SEMICONDUCTOR DEVICE
    3.
    发明申请

    公开(公告)号:US20220157955A1

    公开(公告)日:2022-05-19

    申请号:US17469361

    申请日:2021-09-08

    Abstract: Disclosed is a semiconductor device including a substrate including first and second active regions, a device isolation layer on the substrate and defining first and second active patterns, first and second gate electrodes running across the first and second active regions and aligned with each other, first and second source/drain patterns on the first and second active patterns, a first active contact connecting the first and second source/drain patterns to each other, and a gate cutting pattern between the first and second gate electrodes. An upper portion of the first active contact includes first and second upper dielectric patterns. The first active contact has a minimum width at a portion between the first and second upper dielectric patterns. A minimum width of the gate cutting pattern is a second width. A ratio of the first width to the second width is in a range of 0.8 to 1.2.

    INTEGRATED CIRCUIT DEVICE
    4.
    发明申请

    公开(公告)号:US20220131008A1

    公开(公告)日:2022-04-28

    申请号:US17569952

    申请日:2022-01-06

    Abstract: An integrated circuit device includes a fin-type active region extending on a substrate in a first horizontal direction, a gate line extending on the fin-type active region in a second horizontal direction, first and second source/drain regions arranged on the fin-type active region; a first source/drain contact pattern connected to the first source/drain region and including a first segment having a first height in a vertical direction, a second source/drain contact pattern connected to the second source/drain region and including a second segment having a second height less than the first height in the vertical direction, and an insulating capping line extending on the gate line in the second horizontal direction and including an asymmetric capping portion between the first segment and the second segment, the asymmetric capping portion having a variable thickness in the first horizontal direction.

    SEMICONDUCTOR DEVICES
    5.
    发明申请

    公开(公告)号:US20190148384A1

    公开(公告)日:2019-05-16

    申请号:US15983405

    申请日:2018-05-18

    Abstract: A semiconductor device includes a substrate including active patterns, a device isolation layer filling a trench between a pair of adjacent active patterns, a gate electrode on the active patterns, and a gate contact on the gate electrode. Each active pattern includes source/drain patterns at opposite sides of the gate electrode. The gate contact includes a first portion vertically overlapping with the gate electrode, and a second portion laterally extending from the first portion such that the second portion vertically overlaps with the device isolation layer and does not vertically overlap with the gate electrode. A bottom surface of the second portion is distal to the substrate in relation to a bottom surface of the first portion. The bottom surface of the second portion is distal to the substrate in relation to a top of a source/drain pattern that is adjacent to the second portion.

    INTEGRATED CIRCUIT DEVICE
    6.
    发明申请

    公开(公告)号:US20220375934A1

    公开(公告)日:2022-11-24

    申请号:US17569795

    申请日:2022-01-06

    Abstract: An integrated circuit device includes: a first fin-type active region and a second fin-type active region that extend on a substrate in a straight line in a first horizontal direction and are adjacent to each other in the first horizontal direction; a fin isolation region arranged between the first fin-type active region and the second fin-type active region on the substrate and including a fin isolation insulation structure extending in a second horizontal direction perpendicular to the first horizontal direction; and a plurality of gate lines extending on the first fin-type active region in the second horizontal direction, wherein a first gate line that is closest to the fin isolation region from among the plurality of gate lines is inclined to be closer to a center of the fin isolation region in the first horizontal direction from a lowermost surface to an uppermost surface of the first gate line.

    INTEGRATED CIRCUIT DEVICE
    7.
    发明申请

    公开(公告)号:US20210305427A1

    公开(公告)日:2021-09-30

    申请号:US17028191

    申请日:2020-09-22

    Abstract: An integrated circuit device includes a fin-type active region extending on a substrate in a first horizontal direction, a gate line extending on the fin-type active region in a second horizontal direction, first and second source/drain regions arranged on the fin-type active region; a first source/drain contact pattern connected to the first source/drain region and including a first segment having a first height in a vertical direction, a second source/drain contact pattern connected to the second source/drain region and including a second segment having a second height less than the first height in the vertical direction, and an insulating capping line extending on the gate line in the second horizontal direction and including an asymmetric capping portion between the first segment and the second segment, the asymmetric capping portion having a variable thickness in the first horizontal direction.

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