公开(公告)号：US20240096831A1

公开(公告)日：2024-03-21

申请号：US18455943

申请日：2023-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Enbin Jo ,  Hyungchul Shin ,  Wonil Lee ,  Hyuekjae Lee ,  Gwangjae Jeon

IPC: H01L23/00 ,  H01L25/065

CPC classification number: H01L24/08 ,  H01L25/0657 ,  H01L24/16 ,  H01L2224/0801 ,  H01L2224/08058 ,  H01L2224/08146 ,  H01L2224/16227 ,  H01L2225/06541 ,  H01L2924/37

Abstract: A semiconductor package includes: a first semiconductor chip including a first pad on a first substrate, and a first insulating layer at least partially surrounding the first pad; and a second semiconductor chip including a second pad below a second substrate and contacting the first pad, and a second insulating layer at least partially surrounding the second pad and contacting the first insulating layer. The first pad includes a first surface contacting the second pad and a second surface opposite the first surface, and an inclined side surface between the first surface and the second surface. The inclined side surface includes a first side surface and a second side surface, facing each other and inclined at a first obtuse angle and a second obtuse angle with respect to the second surface, respectively. Each of the first and second obtuse angles is about 100° to about 130°.