Image sensors and electronic devices

    公开(公告)号:US11929384B2

    公开(公告)日:2024-03-12

    申请号:US18186402

    申请日:2023-03-20

    CPC classification number: H01L27/14647 H01L31/035209

    Abstract: An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

    Image sensors and electronic devices

    公开(公告)号:US11616092B2

    公开(公告)日:2023-03-28

    申请号:US17097329

    申请日:2020-11-13

    Abstract: An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

    Sensors and electronic devices
    4.
    发明授权

    公开(公告)号:US11552212B2

    公开(公告)日:2023-01-10

    申请号:US17306271

    申请日:2021-05-03

    Abstract: A sensor includes a first electrode and a second electrode, and a photo-active layer between the first electrode and the second electrode. The photo-active layer includes a light absorbing semiconductor configured to form a Schottky junction with the first electrode. The photo-active layer has a charge carrier trapping site configured to capture photo-generated charge carriers generated based on the light absorbing semiconductor absorbing incident light that enters at least the photo-active layer at a position adjacent to the first electrode. The sensor is configured to have an external quantum efficiency (EQE) that is adjusted based on a voltage bias being applied between the first electrode and the second electrode.

    Battery casing and battery including the same

    公开(公告)号:US10964971B2

    公开(公告)日:2021-03-30

    申请号:US16225795

    申请日:2018-12-19

    Abstract: A battery casing including a container configured to house an electrode assembly, wherein the container includes a bottom wall and a plurality of side walls, the bottom wall and the plurality of side walls are integrated to define an open side opposite to the bottom wall and to define a space for housing the electrode assembly, at least one of the bottom wall and plurality of the side walls includes a composite including a thermotropic liquid crystal polymer and a nanoclay dispersed in the thermotropic liquid crystal polymer, wherein the main chain of the thermotropic liquid crystal polymer includes an aromatic oxycarbonyl repeating unit and an alkylene moiety-containing repeating unit, and at least a portion of the nanoclay is present in an exfoliated state, and an X-ray diffraction pattern of the composite does not exhibit an intrinsic peak corresponding to the nanoclay.

    Polarization film and display device

    公开(公告)号:US09791609B2

    公开(公告)日:2017-10-17

    申请号:US14090007

    申请日:2013-11-26

    CPC classification number: G02B5/305 G02B1/08 Y10T428/1041

    Abstract: A polarization film, including: a hydrophobic polymer resin and a dichroic dye represented by Chemical Formula 1: wherein in Chemical Formula 1, wherein, in Chemical Formula 1, Ar1 is a substituted or unsubstituted C6 to C15 arylene group, Ar2 is a C6 to C15 arylene group substituted with at least one of a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a halogen atom and a halogen-containing group, Ar3 is a C6 to C15 arylene group substituted with an amide group, R1 is a substituted or unsubstituted C1 to C20 alkyl group or a substituted or unsubstituted C1 to C20 alkoxy group, R2 and R3 are each independently a substituted or unsubstituted C1 to C20 alkyl group, or R2 and R3 are linked to each other to form a ring, and n is 1 or 2.

    IMAGE SENSORS AND ELECTRONIC DEVICES
    8.
    发明公开

    公开(公告)号:US20230299115A1

    公开(公告)日:2023-09-21

    申请号:US18186402

    申请日:2023-03-20

    CPC classification number: H01L27/14647 H01L31/035209

    Abstract: An image sensor may include a first photo-sensing device on a semiconductor substrate and configured to sense light of a first wavelength spectrum, and second and third photo-sensing devices integrated in the semiconductor substrate and configured to sense light of a second and third wavelength spectrum, respectively. The first photo-sensing device may overlap each of the second and third photo-sensing devices in a thickness direction of the semiconductor substrate. The second and third photo-sensing devices do not overlap in the thickness direction and each have an upper surface, a lower surface, and a doped region therebetween. The third photo-sensing device includes an upper surface deeper further from the upper surface of the semiconductor substrate than the upper surface of the second photo-sensing device and a doped region thicker than the doped region of the second photo-sensing device. The image sensor may omit the first photo-sensing device.

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