公开(公告)号：US09726204B2

公开(公告)日：2017-08-08

申请号：US14562179

申请日：2014-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato Kajinami ,  Fumitaka Moroishi ,  Keiji Murata ,  Shinji Ueyama ,  Tatsuya Ishimoto ,  Yoshiaki Yukimori

IPC: F01B31/12 ,  F15B15/08 ,  F15B15/28 ,  F15B15/06 ,  F15B15/14

CPC classification number: F15B15/088 ,  F15B15/063 ,  F15B15/1452 ,  F15B15/1461 ,  F15B15/2846 ,  F15B15/2876 ,  F15B2211/6336 ,  F15B2211/665 ,  F15B2211/6651 ,  F15B2211/8855

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

公开(公告)号：US10823682B2

公开(公告)日：2020-11-03

申请号：US16583434

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takamasa Sugiura ,  Fumitaka Moroishi ,  Masato Kajinami

IPC: H01L21/78 ,  G01N21/95 ,  H01L21/67 ,  G01N21/64 ,  G01N21/88 ,  H04N5/235 ,  H04N5/225 ,  G06T7/00 ,  H01L21/687

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

公开(公告)号：US12051604B2

公开(公告)日：2024-07-30

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68

CPC classification number: H01L21/67144 ,  B65G47/905 ,  H01L21/681

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US20230187249A1

公开(公告)日：2023-06-15

申请号：US18078249

申请日：2022-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daisuke NAGATOMO ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H01L23/544

CPC classification number: H01L21/681 ,  G06T7/0004 ,  H01L21/67259 ,  H01L23/544 ,  H01L2223/54426 ,  G06T2207/30148

Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

公开(公告)号：US20220216077A1

公开(公告)日：2022-07-07

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  H01L21/68 ,  B65G47/90

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.