公开(公告)号：US09508577B2

公开(公告)日：2016-11-29

申请号：US14337571

申请日：2014-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Joon Lee ,  Masato Kajinami ,  Yoshiaki Yukimori ,  Sang-Yoon Kim ,  Hui-Jae Kim ,  Byeong-Kuk Park ,  Seung Dae Seok ,  Jae Bong Shin ,  Byeong Kap Choi

IPC: H01L21/66 ,  H01L21/67 ,  H01L23/00 ,  H05K13/04

CPC classification number: H01L21/67259 ,  H01L21/67109 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/73204 ,  H01L2224/75502 ,  H01L2224/7565 ,  H01L2224/75753 ,  H01L2224/75824 ,  H01L2224/7598 ,  H01L2224/81127 ,  H01L2224/81204 ,  H01L2224/81801 ,  H01L2224/83127 ,  H01L2224/83204 ,  H01L2224/8385 ,  H01L2224/92125 ,  H05K13/046 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A semiconductor manufacturing apparatus may include: a pickup unit configured to pick up a chip in a first region of the semiconductor manufacturing apparatus; a bonding head configured to receive the picked-up chip and configured to move from the first region to a top of a circuit board in a second region of the semiconductor manufacturing apparatus; and/or an optical unit configured to detect a bonding position on the circuit board while moving from the first region to the second region. A semiconductor manufacturing apparatus may include: a bonding head including a heater for heating a chip and bonding the chip onto a circuit board; and/or a cooling block, adjacent to the heater, through which cooling liquid flows. The cooling liquid may be removed from the cooling block while the heater generates heat. The cooling liquid may be supplied to the cooling block while the heater is cooled.

Abstract translation: 半导体制造装置可以包括：拾取单元，被配置为拾取半导体制造装置的第一区域中的芯片; 接合头，被配置为接收所拾取的芯片并且被配置为在所述半导体制造装置的第二区域中从所述第一区域移动到电路板的顶部; 和/或配置成在从第一区域移动到第二区域时检测电路板上的接合位置的光学单元。 半导体制造装置可以包括：接合头，包括用于加热芯片并将芯片接合到电路板上的加热器; 和/或与加热器相邻的冷却块，冷却液通过该冷却块流动。 当加热器产生热量时，冷却液体可从冷却块移除。 冷却液可以在加热器被冷却时供应到冷却块。

公开(公告)号：US09726204B2

公开(公告)日：2017-08-08

申请号：US14562179

申请日：2014-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Masato Kajinami ,  Fumitaka Moroishi ,  Keiji Murata ,  Shinji Ueyama ,  Tatsuya Ishimoto ,  Yoshiaki Yukimori

IPC: F01B31/12 ,  F15B15/08 ,  F15B15/28 ,  F15B15/06 ,  F15B15/14

CPC classification number: F15B15/088 ,  F15B15/063 ,  F15B15/1452 ,  F15B15/1461 ,  F15B15/2846 ,  F15B15/2876 ,  F15B2211/6336 ,  F15B2211/665 ,  F15B2211/6651 ,  F15B2211/8855

Abstract: A fluid pressure actuator including a fluid pressure cylinder having a first position detector and a second position detector, a piston body having a piston head and a rod, the piston head mounted on the rod and slidably accommodated in the fluid pressure cylinder, the rod including a first scale and a second scale, the first scale facing the first position detector and the first position detector configured to detect a position in a sliding direction of the piston body, the second scale facing the second position detector and the second position detector configured to detect a position of the rod in a rotation direction of the piston body, and a controller configured to perform a first positioning control of a position of the rod in the sliding direction and a second positioning control of the rod in the rotation direction may be provided.

公开(公告)号：US20230187249A1

公开(公告)日：2023-06-15

申请号：US18078249

申请日：2022-12-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daisuke NAGATOMO ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/68 ,  G06T7/00 ,  H01L21/67 ,  H01L23/544

CPC classification number: H01L21/681 ,  G06T7/0004 ,  H01L21/67259 ,  H01L23/544 ,  H01L2223/54426 ,  G06T2207/30148

Abstract: A mounting device includes: a bonding head configured to hold a first object, a bonding stage configured to hold a second object, and a dual-field-of-view (FOV) optical system including an image sensor configured to simultaneously capture an image of a first alignment mark on the first object and an image of a second alignment mark on the second object to obtain a first image. At least one of the bonding head and the bonding stage is configured to adjust a relative position between the first object and the second object based on the first image, and bond the first object to the second object.

公开(公告)号：US20220216077A1

公开(公告)日：2022-07-07

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  H01L21/68 ,  B65G47/90

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US12051604B2

公开(公告)日：2024-07-30

申请号：US17544197

申请日：2021-12-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daisuke Nagatomo ,  Fumitaka Moroishi ,  Masanori Izumita ,  Shinji Ueyama ,  Takahiro Tokumiya ,  Takamasa Sugiura ,  Tatsuya Ishimoto ,  Masato Kajinami

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/68

CPC classification number: H01L21/67144 ,  B65G47/905 ,  H01L21/681

Abstract: An apparatus for manufacturing a semiconductor device includes a bonding head configured to adsorb and hold a mounting component at a pick-up position, to move between the pick-up position and a mounting position, and to mount the mounting component on a substrate that is on a bonding stage; a camera configured to move together with the bonding head and to capture an image of the mounting component and an image of the substrate; an optical system configured to transmit light between the mounting component and the camera; a fiducial mark configured to move together with the camera in a capturing range of the camera; and a controller configured to correct a positional relationship between the mounting component and the substrate based on a first image including the fiducial mark and the mounting component and a second image including the fiducial mark and the substrate.

公开(公告)号：US09082885B2

公开(公告)日：2015-07-14

申请号：US14283238

申请日：2014-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoshiaki Yukimori ,  Shinji Ueyama ,  Masato Kajinami

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L24/93 ,  H01L21/561 ,  H01L21/78 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83203

Abstract: A method of manufacturing a semiconductor device includes: providing a first substrate that includes internal wiring, the first substrate including an array of chip mounting regions that includes a first chip mounting region; placing the first substrate on a first carrier line; providing a first semiconductor chip; placing the first semiconductor chip on a first moveable tray; vertically aligning the first chip mounting region of the first substrate with the first semiconductor chip, and performing initial bonding of the first semiconductor chip to the first chip mounting region of the first substrate; and performing subsequent bonding on the initially-bonded first semiconductor chip and first mounting region of the first substrate, thereby more strongly bonding the first semiconductor chip to the first substrate at the first mounting region. The initial bonding occurs after performing a subsequent bonding of at least one other semiconductor chip on the first substrate.

Abstract translation: 一种制造半导体器件的方法包括：提供包括内部布线的第一基板，所述第一基板包括具有第一芯片安装区域的芯片安装区域阵列; 将第一衬底放置在第一载体线上; 提供第一半导体芯片; 将第一半导体芯片放置在第一可移动托盘上; 将第一基板的第一芯片安装区域与第一半导体芯片垂直对准，并且将第一半导体芯片初始接合到第一基板的第一芯片安装区域; 以及在所述第一基板的初始结合的第一半导体芯片和第一安装区域上进行后续的接合，从而在所述第一安装区域将所述第一半导体芯片与所述第一基板更牢固地接合。 在执行第一衬底上的至少一个其它半导体芯片的后续接合之后发生初始接合。

公开(公告)号：US11314073B2

公开(公告)日：2022-04-26

申请号：US16547492

申请日：2019-08-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yasuhiro Hidaka ,  Masato Kajinami ,  Takayuki Sasaoka

IPC: G02B21/08 ,  G02B21/36 ,  G02B26/06

Abstract: A lighting device includes a light source generating a beam of illumination light, a ring-shaped aperture shielding a central portion of the illumination light and transforming the beam of illumination light into ring-shaped illumination light, and an object lens focusing the ring-shaped illumination light such that a specimen can be illuminated with the ring-shaped illumination light. An inspection apparatus including the light device also has a beam splitter and an image sensor picking up light reflected and/or diffracted from the specimen through the beam splitter. Because a central portion of the illumination light is shielded, lens flare of light transmitted by the beam splitter and the object lens is prevented thereby preventing speckles in the image produced by the image sensor.

公开(公告)号：US10823682B2

公开(公告)日：2020-11-03

申请号：US16583434

申请日：2019-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Takamasa Sugiura ,  Fumitaka Moroishi ,  Masato Kajinami

IPC: H01L21/78 ,  G01N21/95 ,  H01L21/67 ,  G01N21/64 ,  G01N21/88 ,  H04N5/235 ,  H04N5/225 ,  G06T7/00 ,  H01L21/687

Abstract: A wafer measurement apparatus for measuring a bonding strength of a bonded wafer includes a wafer holder to hold a bonded wafer into which a blade is inserted and where a crack occurs, a lighting assembly including a light source, a light source controller to select the light source of the lighting assembly for detection of the crack reflected in the bonded wafer, on photographing conditions, a photographing assembly to photograph the bonded wafer by using the photographing conditions corresponding to a wavelength of the light source, on sensitivity of the wavelength of the light source, and a calculator to select one photographing condition, transmit the selected photographing condition, and calculate bonding strength, on a crack distance from a blade edge, extracted from an image of the bonded wafer, to a crack edge.

公开(公告)号：US10444162B2

公开(公告)日：2019-10-15

申请号：US15938570

申请日：2018-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Shinji Ueyama ,  Masato Kajinami ,  Tatsuya Ishimoto

IPC: G01N21/88 ,  H01L21/67 ,  H01L21/66 ,  G01B11/30 ,  G01N21/94 ,  G01N21/95 ,  G01B11/06 ,  G01B11/25 ,  H01L21/687

Abstract: An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.