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公开(公告)号:US20190131171A1
公开(公告)日:2019-05-02
申请号:US15959783
申请日:2018-04-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Min Chan Gwak , HWI CHAN JUN , HEON JONG SHIN , SO RA YOU , SANG HYUN LEE , IN CHAN HWANG
IPC: H01L21/768 , H01L23/522 , H01L23/528 , H01L29/66 , H01L29/417
Abstract: A semiconductor device includes a plurality of active regions spaced apart from each other and extending linearly in parallel on a substrate. A gate electrode crosses the plurality of active regions, and respective drain regions are on and/or in respective ones of the active regions on a first side of the gate electrode and respective source regions are on and/or in respective ones of the active regions on a second side of the gate electrode. A drain plug is disposed on the drain regions and a source plug is disposed on the source regions. A gate plug is disposed on the gate electrode between the drain plug and the source plug such that a straight line passing through a center of the drain plug and a center of the source plug intersects the gate plug.
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公开(公告)号:US20170162668A1
公开(公告)日:2017-06-08
申请号:US15348040
申请日:2016-11-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: SUNG MIN KIM , HEON JONG SHIN
IPC: H01L29/66 , H01L29/78 , H01L29/06 , H01L21/762
CPC classification number: H01L29/66545 , H01L21/28114 , H01L21/76224 , H01L29/0653 , H01L29/66795 , H01L29/785 , H01L29/7851
Abstract: A method of manufacturing a semiconductor device includes forming a fin extending in a first direction. A dummy layer is formed including a plurality of semiconductor layers disposed on the fin. Each of the plurality of semiconductor layers have different impurity concentrations from each other. The dummy layer is etched to form a dummy gate electrode.
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