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公开(公告)号：US11448836B2
公开(公告)日：2022-09-20
申请号：US16416727
申请日：2019-05-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ho Chul Ji , Keun Yeong Cho
Abstract: A probe device includes an optical fiber array including an optical fiber to be in optical communication with an optical integrated circuit board, the optical integrated circuit board including an optical coupling element and a reflection mirror, a base substrate fixing the optical fiber, and an intermediate substrate including a hole into which the optical fiber is inserted, and a probe mirror to reflect an optical signal between the reflection mirror and the optical coupling element.
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公开(公告)号：US10705302B2
公开(公告)日：2020-07-07
申请号：US16211712
申请日：2018-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Ho Chul Ji , Keun Yeong Cho
Abstract: A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.
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公开(公告)号：US10712497B2
公开(公告)日：2020-07-14
申请号：US16182763
申请日：2018-11-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ho Chul Ji , Kwan Sik Cho , Keun Yeong Cho
IPC: G02B6/12
Abstract: Photonic integrated circuit packages having improved integration, and methods of manufacturing such photonic integrated circuit packages, are provided. As an example, a photonic integrated circuit package may include a substrate, a first insulating layer on the substrate, a photonic core layer on the first insulating layer, and a second insulating layer on the photonic core layer. A photonic coupling device may be in the photonic core layer, and may be, as examples, at least one of a grating coupler or a photodetector. A concave mirror may extend into at least the second insulating layer. In some embodiments, the concave mirror may extend through the second insulating layer and into the first insulating layer.
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公开(公告)号：US20190265408A1
公开(公告)日：2019-08-29
申请号：US16182763
申请日：2018-11-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ho Chul Ji , Kwan Sik Cho , Keun Yeong Cho
IPC: G02B6/12
Abstract: Photonic integrated circuit packages having improved integration, and methods of manufacturing such photonic integrated circuit packages, are provided. As an example, a photonic integrated circuit package may include a substrate, a first insulating layer on the substrate, a photonic core layer on the first insulating layer, and a second insulating layer on the photonic core layer. A photonic coupling device may be in the photonic core layer, and may be, as examples, at least one of a grating coupler or a photodetector. A concave mirror may extend into at least the second insulating layer. In some embodiments, the concave mirror may extend through the second insulating layer and into the first insulating layer.
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