公开(公告)号：US10712497B2

公开(公告)日：2020-07-14

申请号：US16182763

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho Chul Ji ,  Kwan Sik Cho ,  Keun Yeong Cho

IPC: G02B6/12

Abstract: Photonic integrated circuit packages having improved integration, and methods of manufacturing such photonic integrated circuit packages, are provided. As an example, a photonic integrated circuit package may include a substrate, a first insulating layer on the substrate, a photonic core layer on the first insulating layer, and a second insulating layer on the photonic core layer. A photonic coupling device may be in the photonic core layer, and may be, as examples, at least one of a grating coupler or a photodetector. A concave mirror may extend into at least the second insulating layer. In some embodiments, the concave mirror may extend through the second insulating layer and into the first insulating layer.

公开(公告)号：US12230658B2

公开(公告)日：2025-02-18

申请号：US17548712

申请日：2021-12-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Min Ho Jang ,  Seung Kuk Kang ,  Hae Sung Jung ,  Kwan Sik Cho ,  Ho-Chul Ji

IPC: H01L27/146

Abstract: An image sensor includes a substrate having first and second surfaces and first and second regions. Unit pixels including photoelectric conversion layers are arranged inside the first region. A pixel separation pattern extends from the first surface to the second surface in the first region, separates each of the unit pixels, and includes a pixel separation spacer film and a pixel separation filling film. A dummy pixel separation pattern extends from the first surface to the second surface in the second region, and includes a dummy pixel separation filling film. A wiring structure disposed on the second surface includes an inter-wiring insulating film and a first wiring. A first contact directly connects the dummy pixel separation filling film and connects the dummy pixel separation filling film to the first wiring. A height of the pixel separation filling film is greater than a height of the dummy pixel separation filling film.

公开(公告)号：US12027556B2

公开(公告)日：2024-07-02

申请号：US17383976

申请日：2021-07-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Mo Im ,  Ja Meyung Kim ,  Jong Eun Park ,  Beom Suk Lee ,  Kwan Sik Cho

IPC: H01L27/146 ,  H01L27/148

CPC classification number: H01L27/1463 ,  H01L27/14603 ,  H01L27/14636 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/14831

Abstract: An image sensor includes a substrate, a photoelectric conversion region disposed inside the substrate, a first active region disposed inside the substrate to include a ground region, a floating diffusion region, and a channel region for connecting the ground region and the floating diffusion region, a substrate trench disposed inside the channel region, a transfer gate disposed on a face of the substrate to include a lower gate which fills a part of the substrate trench and has a first width, and an upper gate having a second width smaller than the first width on the lower gate, and a gate spacer disposed inside the substrate trench to be interposed between the ground region and the upper gate.

公开(公告)号：US20190265408A1

公开(公告)日：2019-08-29

申请号：US16182763

申请日：2018-11-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho Chul Ji ,  Kwan Sik Cho ,  Keun Yeong Cho

IPC: G02B6/12

Abstract: Photonic integrated circuit packages having improved integration, and methods of manufacturing such photonic integrated circuit packages, are provided. As an example, a photonic integrated circuit package may include a substrate, a first insulating layer on the substrate, a photonic core layer on the first insulating layer, and a second insulating layer on the photonic core layer. A photonic coupling device may be in the photonic core layer, and may be, as examples, at least one of a grating coupler or a photodetector. A concave mirror may extend into at least the second insulating layer. In some embodiments, the concave mirror may extend through the second insulating layer and into the first insulating layer.