公开(公告)号：US20140287564A1

公开(公告)日：2014-09-25

申请号：US14287546

申请日：2014-05-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keum-Seok Park ,  Seung-Hun Lee ,  Byeong-Chan Lee ,  Sang-Bom Kang ,  Hong-Bum Park

IPC: H01L29/66 ,  H01L29/08

CPC classification number: H01L29/66621 ,  H01L29/0847 ,  H01L29/165 ,  H01L29/66628 ,  H01L29/66636 ,  H01L29/7834 ,  H01L29/7848

Abstract: Semiconductor devices are provided including a substrate having a first surface and a second surface recessed from opposite sides of the first surface, a gate pattern formed on the first surface and having a gate insulating layer and a gate electrode, a carbon-doped silicon buffer layer formed on the second surface, and source and drain regions doped with an n-type dopant or p-type dopant, epitaxially grown on the silicon buffer layer to be elevated from a top surface of the gate insulating layer.

Abstract translation: 提供了半导体器件，其包括具有从第一表面的相对侧凹入的第一表面和第二表面的衬底，形成在第一表面上并具有栅极绝缘层和栅电极的栅极图案，碳掺杂硅缓冲层 形成在第二表面上，以及掺杂有n型掺杂剂或p型掺杂剂的源极和漏极区，其外延生长在硅缓冲层上以从栅极绝缘层的顶表面升高。