公开(公告)号：US10008398B2

公开(公告)日：2018-06-26

申请号：US15369138

申请日：2016-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang-il Choi ,  Byung-ho Kim ,  Hong-seok Choi

IPC: H01L21/00 ,  H01L21/67 ,  H01L21/687 ,  B24B41/06 ,  B24B49/12 ,  B24B55/02 ,  B24B7/22

CPC classification number: H01L21/67092 ,  B24B7/228 ,  B24B41/068 ,  B24B49/12 ,  B24B55/02 ,  H01L21/67051 ,  H01L21/68714

Abstract: A substrate thinning apparatus includes a chuck table capable of supporting a substrate, a rotatable grinding device which includes a wheel tip capable of grinding the substrate supported by the chuck table, and a cleaning device configured to perform synchronized cleaning of the wheel tip while the grinding device is rotated. When the substrate thinning apparatus is used, even an extremely thin semiconductor device can be fabricated with substantial reliability.