公开(公告)号：US20160351517A1

公开(公告)日：2016-12-01

申请号：US15164502

申请日：2016-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hongbin SHI ,  Kang Joon LEE

IPC: H01L23/00

CPC classification number: H01L24/05 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/02135 ,  H01L2224/02145 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05555 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/06131 ,  H01L2224/0615 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/13014 ,  H01L2224/13022 ,  H01L2224/13026 ,  H01L2224/13027 ,  H01L2224/14131 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An electric apparatus may include a plurality of electric patterns arranged on a substrate. Each of the electric patterns may include a pad for connection with a solder ball, an electrical trace laterally extending from a portion of the pad to allow an electrical signal to be transmitted from or to the pad, a first dummy trace laterally extending from other portion of the pad, and a first connection line connecting the first dummy trace to the electrical trace. The first dummy trace may be provided at a position deviated from a straight line connecting the pad to the electrical trace.

Abstract translation: 电气设备可以包括布置在基板上的多个电图案。 每个电图案可以包括用于与焊球连接的焊盘，从焊盘的一部分横向延伸的电迹线以允许电信号从焊盘或从焊盘传输，第一虚拟焊盘从其他部分横向延伸 以及将第一虚拟轨迹连接到电迹线的第一连接线。 可以将第一虚拟轨迹设置在偏离连接焊盘与电迹线的直线的位置处。