公开(公告)号：US20170136570A1

公开(公告)日：2017-05-18

申请号：US15340303

申请日：2016-11-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Dae Seok ,  Sang Yoon Kim ,  Hui Jae KIM ,  Jae Bong SHIN ,  Byung Joon LEE

IPC: B23K20/02 ,  B23K20/00 ,  B23K20/26 ,  H01L23/00

CPC classification number: B23K20/026 ,  B23K3/085 ,  B23K20/004 ,  B23K20/26 ,  B23K37/003 ,  H01L24/75 ,  H01L2224/75251 ,  H01L2224/75501 ,  H01L2224/7598 ,  H01L2224/75988

Abstract: A bonding stage is provided. The bonding stage includes a first heater disposed under a first region of a substrate having a plurality of semiconductor chips disposed thereon, a second heater disposed under a second region different from the first region of the substrate, a cooler disposed under the first heater and the second heater and blocking heat of the first heater and heat of the second heater from being transferred to lower portions of the first heater and the second heater, and a thin plate disposed on the first heater and the second heater to support the substrate and transferring the heat of the first heater and the heat of the second heater to the substrate, wherein the first heater and the second heater are independently operated.