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    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
    1.
    发明申请
    SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20250070039A1

    公开(公告)日：2025-02-27

    申请号：US18632486

    申请日：2024-04-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Kwangyong Lee

    IPC: H01L23/544 ,  H01L23/00 ,  H01L25/065

    Abstract: A semiconductor package includes a package substrate and at least two semiconductor chips stacked on the package substrate and electrically connected to the package substrate via a wire, in which a first semiconductor chip located on a lower side among the at least two semiconductor chips is coupled, without an adhesive, to a second semiconductor chip located above the first semiconductor chip.

    SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DIE STACKS
    2.
    发明申请
    SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR DIE STACKS 有权

    公开(公告)号：US20250062287A1

    公开(公告)日：2025-02-20

    申请号：US18670352

    申请日：2024-05-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kwangyong Lee

    IPC: H01L25/065

    Abstract: A semiconductor package includes a lower semiconductor die stack in which lower semiconductor dies are stacked vertically in a stepwise manner to extend in a first horizontal direction, an upper semiconductor die stack in which upper semiconductor dies are stacked vertically on the lower semiconductor die stack in a stepwise manner to extend in a first reverse horizontal direction, a wiring structure above the upper semiconductor die stack, and bonding wire groups connecting the lower semiconductor dies and the upper semiconductor dies to the wiring structure. The bonding wire groups include a first bonding wire group that includes bonding wires that connect a first plurality of semiconductor dies of the upper and lower semiconductor dies to the wiring structure. The bonding wire group includes a first curved wire connecting a second plurality of semiconductor dies of the first plurality of semiconductor dies, a first upward wire connected to the first curved wire, a first inclined wire connected to the first upward wire, and a second upward wire to connect the first inclined wire to the wiring structure.

    Electronic device including slot antenna module
    3.
    发明授权
    Electronic device including slot antenna module 有权

    公开(公告)号：US11581627B2

    公开(公告)日：2023-02-14

    申请号：US17074805

    申请日：2020-10-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jangsun Yoo ,  Sunggeun Go ,  Jihye Moon ,  Myeonggil Lee ,  Jongmyung Kim ,  Cheehwan Yang ,  Kwangyong Lee

    IPC: H01Q1/24 ,  H01Q13/10 ,  H01Q1/38 ,  H01Q1/22

    Abstract: In an embodiment, an electronic device may include a first cover covering an upper portion of a main body and containing a first antenna module disposed on a lateral portion thereof, a spacer member disposed over the first cover, and a second cover disposed over the spacer member. The first and second covers may be spaced apart from each other at a predetermined distance due to the spacer member, and a separation space between the first and second covers may be configured to operate as a second antenna module. It is therefore possible to guarantee high-efficiency wireless performance having iso-directionality without compromising the design of the electronic device. Other embodiments are also possible.

    Shielding member and electronic device including the same
    4.
    发明授权
    Shielding member and electronic device including the same 有权

    公开(公告)号：US11553629B2

    公开(公告)日：2023-01-10

    申请号：US17142705

    申请日：2021-01-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Myeonggil Lee ,  Hyein Park ,  Jangsun Yoo ,  Jaedeok Lim ,  Jihye Moon ,  Cheehwan Yang ,  Kwangyong Lee ,  Moonhee Lee

    IPC: H05K9/00 ,  H05K7/20 ,  H01L25/18 ,  H05K1/18

    Abstract: An electronic device including a shielding member for performing an electromagnetic interference (EMI) shielding function is provided. The electronic device includes a printed circuit board including a first area in which first electronic components having a first frequency as a driving frequency are mounted, and a second area in which second electronic components having a second frequency as a driving frequency are mounted, a shielding film disposed to cover the first area and the second area of the printed circuit board and attached to a first ground portion of the printed circuit board, and at least one conductive member formed to extend in a direction perpendicular to an extending direction of the printed circuit board. The at least one conductive member includes a first end that contacts the shielding film, and a second end that contacts a second ground portion of the printed circuit board, the second end being disposed between the first area and the second area of the printed circuit board.

    Electronic device including antenna
    5.
    发明授权
    Electronic device including antenna 有权

    公开(公告)号：US12021296B2

    公开(公告)日：2024-06-25

    申请号：US17438976

    申请日：2020-03-13

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jangsun Yoo ,  Jingyu Choi ,  Jongmyung Kim ,  Jihye Moon ,  Cheehwan Yang ,  Kwangyong Lee ,  Myeonggil Lee ,  Seungwoon Lee

    IPC: H01Q1/22 ,  H01Q1/48 ,  H01Q21/28

    CPC classification number: H01Q1/2266

    Abstract: According to an embodiment, an electronic device may comprise: a first housing structure comprising a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, a first side surface and a second side surface facing opposite to each other and surrounding at least a part of the space between the first surface and the second surface, and a third side surface and a fourth side surface facing opposite to each other while being perpendicular to the first side surface; a second housing structure comprising a third surface facing in a third direction, a fourth surface facing in a fourth direction opposite to the third direction, a fifth side surface and a sixth side surface facing opposite to each other and surrounding at least a part of the space between the third surface and the fourth surface, and a seventh side surface and an eighth side surface facing opposite to each other while being perpendicular to the fifth side surface; a hinge structure connecting between the first side surface and the fifth side surface; a display disposed along at least a part of the third surface; at least one antenna disposed near the first side surface inside the first housing structure; and at least one wireless communication module configured to transmit and/or receive a signal in a selected or designated frequency band through the at least one antenna. Various other embodiments may be possible.

    Method and device for split tunneling
    7.
    发明授权
    Method and device for split tunneling 有权

    公开(公告)号：US12255873B2

    公开(公告)日：2025-03-18

    申请号：US18104940

    申请日：2023-02-02

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Dongwon Seo ,  Taejune Kim ,  Kwangyong Lee

    IPC: H04L9/40

    Abstract: An electronic device may obtain a security rule for supporting split tunneling, check a condition for executing a first operation related to bypassing the VPN tunnel by comparing a first value to information based on a first offset in a first element of the packet based on the security rule, check a condition for performing a second operation related to bypassing the VPN tunnel by comparing a second value to information based on a second offset in a second element of the packet when the condition for executing the first operation is satisfied and the first operation instructs that the second element of the packet be inspected, encapsulate the packet while not including the packet in the VPN tunnel and transmit the encapsulated packet to a packet forwarding server, and include the packet in the VPN tunnel and transmit the packet to the packet forwarding server.

    Shielding film including plurality of layers and electronic device using the same
    10.
    发明授权
    Shielding film including plurality of layers and electronic device using the same 有权

    公开(公告)号：US11291144B2

    公开(公告)日：2022-03-29

    申请号：US16669592

    申请日：2019-10-31

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Myeonggil Lee ,  Hyein Park ,  Jaedeok Lim ,  Jihye Moon ,  Cheehwan Yang ,  Jangsun Yoo ,  Kwangyong Lee

    IPC: H05K9/00 ,  H05K7/20

    Abstract: An electronic device and a shielding film are disclosed herein. The electronic device includes a printed circuit board and at least one electrical component mounted on the printed circuit board. The shielding film is disposed on at least a part of the printed circuit board to block electromagnetic waves generated by the printed circuit board and/or the electronic component. The shielding film includes a plurality of layers, and is attached to at least part of the printed circuit board and contacting an upper side surface of the electronic component, wherein at least part of the shielding film includes a nano-conductive fiber and is electrically connected with a ground part of the printed circuit board through the nano-conductive fiber.

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