公开(公告)号：US11621381B2

公开(公告)日：2023-04-04

申请号：US16678106

申请日：2019-11-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byunghoon Lee ,  Jamyeong Koo

IPC: H01L33/62 ,  H01L25/075

Abstract: A micro-LED mounting structure includes a first layer having a conductive pad disposed on a surface thereof, a second layer including a first surface, a second surface opposite the first surface and disposed on the surface of the first layer, and a via-hole extending from the conductive pad of the first layer to the first surface and including a conductive material, and a micro-LED disposed on the first surface of the second layer to be electrically connected with the conductive material included in the via-hole. The via-hole includes a first opening in the first surface of the second layer and in which the conductive material is formed, the conductive material of the first surface provides a conductive area on a portion of the first surface of the second layer, and the conductive area and an area within a specified area of the conductive area define a substantially flat surface.

公开(公告)号：US11417627B2

公开(公告)日：2022-08-16

申请号：US16992004

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong Koo ,  Sungyong Min ,  Byunghoon Lee ,  Changjoon Lee ,  Changkyu Chung ,  Youngkyong Jo

IPC: H01L23/00 ,  H01L25/16 ,  H01L25/075 ,  H01L25/00

Abstract: A micro LED display manufacturing method according to various embodiments may include: a first operation of bonding an anisotropic conductive film including a plurality of conductive particles onto one surface of a prepared substrate, the one surface including a circuit part; a second operation of forming a bonding layer on the anisotropic conductive film; a third operation of positioning a plurality of micro LED chips above the bonding layer, the micro LED chips being arranged on a carrier substrate while being spaced a first distance apart from the substrate; a fourth operation of attaching the plurality of micro LED chips onto the bonding layer by means of laser transfer; and a fifth operation of forming a conductive structure for electrically connecting a connection pad to the circuit part through the conductive particles by means of heating and pressurizing.

公开(公告)号：US12218295B2

公开(公告)日：2025-02-04

申请号：US17456838

申请日：2021-11-29

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Byunghoon Lee ,  Taeil Kim ,  Jamyeong Koo ,  Juseung Lee

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/16

Abstract: Various embodiments of the disclosure disclose a method for manufacturing a micro Light Emitting Diode (LED) display. The disclosed manufacturing method may include coating a face of a substrate including a circuit portion with a first thickness of a polymer adhesive solution containing a plurality of metal particles, attaching an array of micro LED chips on the polymer adhesive solution, physically connecting a connection pad for each of the array of micro LED chips to the metal particles through heating and pressing the attached plurality of micro LED chips to descend through the polymer adhesive solution, and chemically bonding the metal particles to the connection pad and the circuit portion through heating and pressing so that the micro LED chips are electrically connected to the circuit portion. Various other embodiments are also possible.

公开(公告)号：US11457528B2

公开(公告)日：2022-09-27

申请号：US16894094

申请日：2020-06-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jamyeong Koo ,  Jaedeok Lim ,  Hyein Park ,  Gyuyeong Cho

IPC: H01Q1/24 ,  H05K1/02 ,  H01Q1/12 ,  H05K3/30

Abstract: An electronic device is provided. The electronic device includes an electronic device including a housing including a front plate, a rear plate, and a member surrounding at least part of a space between the front plate and the rear plate and operating as an antenna radiator by being formed of a metal material at least in part, a support member including a first face and a second face, disposed between a display and the rear plate, supporting the display on the first face, and bonded to part of the side member, a printed circuit board, a housing groove formed on a first portion of the member, a conductive body bonded to the housing groove through a press-fit process, and a connection terminal disposed on the printed circuit board and electrically coupling the press-fitted conductive body to the printed circuit board.

公开(公告)号：US11063174B2

公开(公告)日：2021-07-13

申请号：US16653449

申请日：2019-10-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Doyoung Kwag ,  Masaru Wada ,  Jamyeong Koo ,  Eunhye Kim ,  Sangmoo Park ,  Seona Yang ,  Minsub Oh ,  Yoonsuk Lee ,  Youngkyong Jo

IPC: H01L33/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/46

Abstract: A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.