公开(公告)号：US20240178188A1

公开(公告)日：2024-05-30

申请号：US18363140

申请日：2023-08-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Myung-Sung KANG ,  Kyong Hwan KOH ,  Jin-Woo PARK ,  Chung Sun LEE ,  Hyeon Jun JIN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/15311 ,  H01L2924/182

Abstract: Semiconductor packages and methods of fabricating the same are provided. The semiconductor package includes a first package substrate including a first area, a first semiconductor chip mounted on the first area, a second package substrate disposed on an upper surface of the first semiconductor chip and including a second area and a first hole penetrating through the second area, a second semiconductor chip mounted on the second area, a connection member electrically connecting the first package substrate and the second package substrate and between the first package substrate and the second package substrate, and a mold film covering the second semiconductor chip on the second package substrate, filling the first hole, and covering the first semiconductor chip and the connection member on the first package substrate.