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公开(公告)号:US09773806B1
公开(公告)日:2017-09-26
申请号:US15390977
申请日:2016-12-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byoung Il Lee , Kyung Jun Shin , Dong Seog Eun , Ji Hye Kim , Hyun Kook Lee
IPC: H01L21/8239 , H01L27/115 , H01L27/11582 , H01L27/11568 , G11C16/24 , G11C16/04 , H01L21/8238
CPC classification number: H01L27/11582 , G11C16/0466 , G11C16/0483 , H01L21/823885 , H01L21/8239 , H01L27/1157
Abstract: A semiconductor device includes gate electrodes and interlayer insulating layers alternately stacked on a substrate, a channel layer penetrating through the gate electrodes and the interlayer insulating layers, and a gate dielectric layer disposed on an external surface of the channel layer between the gate electrodes and the channel layer. In addition, the channel layer includes a first region extended in a direction perpendicular to a top surface of the substrate and a second region connected to the first region in a lower portion of the first region and including a plane inclined with respect to the top surface of the substrate.
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公开(公告)号:US20190115366A1
公开(公告)日:2019-04-18
申请号:US16212240
申请日:2018-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: BYOUNG IL LEE , Joong Shik Shin , Dong Seog Eun , Kyung Jun Shin , Hyun Kook Lee
IPC: H01L27/11582 , H01L27/02 , H01L27/11565
Abstract: A vertical memory device is provided as follows. A substrate has a cell array region and a connection region adjacent to the cell array region. A first gate stack includes gate electrode layers spaced apart from each other in a first direction perpendicular to the substrate. The gate electrode layers extends from the cell array region to the connection region in a second direction perpendicular to the first direction to form a first stepped structure on the connection region. The first stepped structure includes a first gate electrode layer and a second gate electrode layer sequentially stacked. The second gate electrode layer includes a first region having the same length as a length of the first gate electrode layer and a second region having a shorter length than the length of the first gate electrode layer.
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公开(公告)号:US10211220B2
公开(公告)日:2019-02-19
申请号:US15688011
申请日:2017-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Byoung Il Lee , Kyung Jun Shin , Dong Seog Eun , Ji Hye Kim , Hyun Kook Lee
IPC: H01L27/115 , H01L27/11582 , G11C16/04 , H01L27/1157 , H01L21/8239 , H01L21/8238 , H01L27/11568
Abstract: A semiconductor device includes gate electrodes and interlayer insulating layers alternately stacked on a substrate, a channel layer penetrating through the gate electrodes and the interlayer insulating layers, and a gate dielectric layer disposed on an external surface of the channel layer between the gate electrodes and the channel layer. In addition, the channel layer includes a first region extended in a direction perpendicular to a top surface of the substrate and a second region connected to the first region in a lower portion of the first region and including a plane inclined with respect to the top surface of the substrate.
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公开(公告)号:US10204919B2
公开(公告)日:2019-02-12
申请号:US15252740
申请日:2016-08-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Byoung Il Lee , Joong Shik Shin , Dong Seog Eun , Kyung Jun Shin , Hyun Kook Lee
IPC: H01L27/115 , H01L27/11582 , H01L27/02 , H01L27/11565
Abstract: A vertical memory device is provided as follows. A substrate has a cell array region and a connection region adjacent to the cell array region. A first gate stack includes gate electrode layers spaced apart from each other in a first direction perpendicular to the substrate. The gate electrode layers extends from the cell array region to the connection region in a second direction perpendicular to the first direction to form a first stepped structure on the connection region. The first stepped structure includes a first gate electrode layer and a second gate electrode layer sequentially stacked. The second gate electrode layer includes a first region having the same length as a length of the first gate electrode layer and a second region having a shorter length than the length of the first gate electrode layer.
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