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1.发明授权Antenna structure in wireless communication system and operation method thereof 有权无线通信系统中的天线结构及其运行方法公开(公告)号：US09407007B2
公开(公告)日：2016-08-02
申请号：US13827378
申请日：2013-03-14
Inventor： Duck-Dong Hwang , Chul-Soon Park , In-Sang Song , Inn-Yeal Oh , Chae-Jun Lee
Abstract: An antenna device in a wireless communication includes antenna wires of four sides which include three feeding points and have a loop structure and four main switches which are located among the antenna wires of the four sides, wherein the antenna device operates as a loop antenna when the antenna wires of the four sides are connected according to operations of the main switches and wherein the antenna device operates as dipole antennas when the antenna wires of the four sides are disconnected according to operations of the main switches.
Abstract translation: 无线通信中的天线装置包括四边的天线导线，其包括三个馈电点并且具有环形结构，并且四个主开关位于四边的天线中，其中天线装置作为环形天线工作时 根据主开关的操作，四边的天线被连接，其中根据主开关的操作，当四边的天线被断开时，天线装置作为偶极天线工作。
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2.发明申请ANTENNA STRUCTURE IN WIRELESS COMMUNICATION SYSTEM AND OPERATION METHOD THEREOF 有权无线通信系统中的天线结构及其操作方法公开(公告)号：US20130241782A1
公开(公告)日：2013-09-19
申请号：US13827378
申请日：2013-03-14
Inventor： Duck-Dong Hwang , Chul-Soon Park , In-Sang Song , Inn-Yeal Oh , Chae-Jun Lee
Abstract: An antenna device in a wireless communication includes antenna wires of four sides which include three feeding points and have a loop structure and four main switches which are located among the antenna wires of the four sides, wherein the antenna device operates as a loop antenna when the antenna wires of the four sides are connected according to operations of the main switches and wherein the antenna device operates as dipole antennas when the antenna wires of the four sides are disconnected according to operations of the main switches.
Abstract translation: 无线通信中的天线装置包括四边的天线导线，其包括三个馈电点并且具有环形结构，并且四个主开关位于四边的天线中，其中天线装置作为环形天线工作时 根据主开关的操作，四边的天线被连接，其中根据主开关的操作，当四边的天线被断开时，天线装置作为偶极天线工作。
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公开(公告)号：US11706509B2
公开(公告)日：2023-07-18
申请号：US17699393
申请日：2022-03-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seung Hak Lee , Hyunjin Kang , In-Sang Song
Abstract: An electronic system including a camera module comprises a camera module on a metal plate, a metal flange surrounding the camera module, a metal frame connected to the metal flange, and a first adhesion member between the metal flange and the metal plate. The camera module includes a substrate including a cavity, an image sensor in the cavity, and a lens assembly on the image sensor. An area of the metal plate is greater than that of the substrate, from a plan view. The metal plate includes a first part overlapping the substrate from the plan view, and a second part not overlapping the substrate from the plan view. The second part corresponds to an edge portion of the metal plate. The image sensor contacts the metal plate through an adhesive material. A lower portion of the metal flange and the second part of the metal plate contact the first adhesion member.
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Patent Agency Ranking
公开(公告)号：US11218651B2
公开(公告)日：2022-01-04
申请号：US16786472
申请日：2020-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： In-Sang Song , Hyunsu Jun
IPC: H04N5/33
Abstract: An image sensor chip includes a substrate; an image sensor chip provided on the substrate; and an adhesive film provided between the image sensor chip and the substrate in a semi-cured state. A first width of the adhesive film is equal to a second width of the image sensor chip.
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5.发明授权Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same 有权包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法公开(公告)号：US08829667B2
公开(公告)日：2014-09-09
申请号：US13968731
申请日：2013-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Woo Park , Wang-Ju Lee , In-Sang Song
IPC: H01L23/552 , H01L23/31
CPC classification number: H01L23/552 , H01L23/3128 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06568 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.
Abstract translation: 电子设备包括主板，半导体封装，上导电EMI屏蔽构件和下导电EMI屏蔽构件。 主板包括第一接地垫。 半导体封装与主板间隔开并电连接到主板。 上导电EMI屏蔽构件覆盖半导体封装的顶表面和侧壁。 下导电EMI屏蔽构件围绕主板和半导体封装之间的空间，并且电连接到上导电EMI屏蔽构件和第一接地垫。
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6.发明申请ELECTRONIC DEVICES INCLUDING EMI SHIELD STRUCTURES FOR SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME 有权包括用于半导体封装的EMI屏蔽结构的电子器件及其制造方法公开(公告)号：US20140048913A1
公开(公告)日：2014-02-20
申请号：US13968731
申请日：2013-08-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Young-Woo Park , Wang-Ju Lee , In-Sang Song
IPC: H01L23/552
CPC classification number: H01L23/552 , H01L23/3128 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/48145 , H01L2224/48227 , H01L2224/73265 , H01L2225/06506 , H01L2225/0651 , H01L2225/06537 , H01L2225/06568 , H01L2924/15311 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00
Abstract: An electronic apparatus includes a main board, a semiconductor package, an upper conductive EMI shield member, and a lower conductive EMI shield member. The main board includes a first ground pad. The semiconductor package is spaced apart from and electrically connected to the main board. The upper conductive EMI shield member covers a top surface and a sidewall of the semiconductor package. The lower conductive EMI shield member surrounds a space between the main board and the semiconductor package, and is electrically connected to the upper conductive EMI shield member and the first ground pad.
Abstract translation: 电子设备包括主板，半导体封装，上导电EMI屏蔽构件和下导电EMI屏蔽构件。 主板包括第一接地垫。 半导体封装与主板间隔开并电连接到主板。 上导电EMI屏蔽构件覆盖半导体封装的顶表面和侧壁。 下导电EMI屏蔽构件围绕主板和半导体封装之间的空间，并且电连接到上导电EMI屏蔽构件和第一接地垫。
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公开(公告)号：US09728862B2
公开(公告)日：2017-08-08
申请号：US14101172
申请日：2013-12-09
Inventor： Won-Suk Choi , Chul-Soon Park , In-Sang Song , Inn-Yeal Oh , Joong-Ho Lee , Chae-Jun Lee
Abstract: A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.
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公开(公告)号：US20140225794A1
公开(公告)日：2014-08-14
申请号：US14101172
申请日：2013-12-09
Inventor： Won-Suk Choi , Chul-Soon Park , In-Sang Song , Inn-Yeal Oh , Joong-Ho Lee , Chae-Jun Lee
Abstract: A wireless communication system provides an antenna apparatus for the wireless communication system. The antenna apparatus includes a base, a plurality of Yagi-Uda antenna modules disposed in a specific arrangement, a plurality of floating metal modules correspondingly installed in upper portions of the Yagi-Uda antenna modules and selectively connected to a corresponding Yagi-Uda module among the plurality of Yagi-Uda antenna modules, a switching element for selectively switching the floating metal module and the Yagi-Uda antenna module, and a controller for controlling the Yagi-Uda antenna module to comprise a directivity in a desired direction by selectively switching the switching element.
Abstract translation: 无线通信系统提供用于无线通信系统的天线装置。 天线装置包括基座，以具体布置设置的多个八木Uda天线模块，相应地安装在八木宇达天线模块的上部的多个浮动金属模块，并且选择性地连接到相应的Yagi-Uda模块 多个Yagi-Uda天线模块，用于选择性地切换浮动金属模块和Yagi-Uda天线模块的开关元件，以及用于通过选择性地切换Yagi-Uda天线模块来控制Yagi-Uda天线模块以包括期望方向的方向性的控制器 开关元件
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