公开(公告)号：US20190203353A1

公开(公告)日：2019-07-04

申请号：US16043255

申请日：2018-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： IL JUN JEON ,  Ji Ho Uh ,  Je Hak Lee ,  Jun Sung Lee ,  Ji Woon Im

IPC: C23C16/458 ,  H01J37/32 ,  C23C16/50 ,  H01L21/687

CPC classification number: C23C16/4585 ,  C23C16/50 ,  H01J37/32715 ,  H01L21/68771

Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.