公开(公告)号：US20180323094A1

公开(公告)日：2018-11-08

申请号：US15867068

申请日：2018-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MU YER LEE ,  Hyo Bum Kang ,  Jun Sung Lee ,  Jae Lyang Jung ,  Young Min Hur

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67288 ,  H01L21/6838

Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.

公开(公告)号：US20190203353A1

公开(公告)日：2019-07-04

申请号：US16043255

申请日：2018-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： IL JUN JEON ,  Ji Ho Uh ,  Je Hak Lee ,  Jun Sung Lee ,  Ji Woon Im

IPC: C23C16/458 ,  H01J37/32 ,  C23C16/50 ,  H01L21/687

CPC classification number: C23C16/4585 ,  C23C16/50 ,  H01J37/32715 ,  H01L21/68771

Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.

公开(公告)号：US11098406B2

公开(公告)日：2021-08-24

申请号：US16043255

申请日：2018-07-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il Jun Jeon ,  Ji Ho Uh ,  Je Hak Lee ,  Jun Sung Lee ,  Ji Woon Im

IPC: C23C16/458 ,  H01L21/687 ,  C23C16/50 ,  H01J37/32

Abstract: A substrate support unit according to an example embodiment of the present inventive concept may include a support having an upper surface on which a substrate is disposed; a coupling ring on which an edge of the substrate is disposed, the coupling ring being having an annular shape, wherein the coupling ring is disposed on an edge of the support; and an arm part for raising and lowering the coupling ring and the substrate, wherein the arm part is disposed below the coupling ring and under a portion of the coupling ring, wherein the coupling ring has a first region disposed on the arm part and a second region disposed around the first region, wherein the first region has a thickness greater than that of the second region.

公开(公告)号：US10825703B2

公开(公告)日：2020-11-03

申请号：US15867068

申请日：2018-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Mu Yer Lee ,  Hyo Bum Kang ,  Jun Sung Lee ,  Jae Lyang Jung ,  Young Min Hur

IPC: H01L21/67 ,  H01L21/683

Abstract: A particle detection device includes a chuck stage on which a wafer is configured to be seated, first and second adsorption holes shaped as closed concentric curves passing through the chuck stage, a first adsorption module connected to the first adsorption hole under the chuck stage and configured to provide a vacuum pressure, a second adsorption module connected to the second adsorption hole under the chuck stage and configured to provide a vacuum pressure, a pressure gauge configured to measure vacuum pressures of the first and second adsorption holes and a detection module configured to receive the vacuum pressures of the first and second adsorption holes from the pressure gauge and detect whether the wafer is fixed or not and whether particle is present or not, based on the received vacuum pressures. The first and second adsorption modules sequentially provide the vacuum pressure to the first and second adsorption holes.