公开(公告)号：US20230155636A1

公开(公告)日：2023-05-18

申请号：US18154433

申请日：2023-01-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Danbi JEON ,  Bonmin KOO ,  Jonghwa KIM ,  Jihye KIM ,  Inho NA ,  Dongsik SHIN ,  Seunghwan YOON ,  Jongwook ZEONG

IPC: H04B7/0413 ,  H01P1/207 ,  H05K1/02 ,  H05K1/11

CPC classification number: H04B7/0413 ,  H01P1/207 ,  H05K1/0243 ,  H05K1/115 ,  H05K2201/1006 ,  H05K2201/10098

Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than a 4th generation (4G) communication system, such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a filter for filtering a radio frequency (RF) signal, and a sub printed circuit board (PCB), the sub-PCB comprises a passive circuit for processing the RF signal, and, the sub-PCB may be coupled to the filter such that the filter operates as a bumper when being coupled to a filter board.