中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

8 records (took 0.016 seconds)

    ANTENNA FILTER AND ELECTRONIC DEVICE COMPRISING SAME IN WIRELESS COMMUNICATION SYSTEM
    1.
    发明申请
    ANTENNA FILTER AND ELECTRONIC DEVICE COMPRISING SAME IN WIRELESS COMMUNICATION SYSTEM 有权

    公开(公告)号：US20230062103A1

    公开(公告)日：2023-03-02

    申请号：US17981848

    申请日：2022-11-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seunghwan YOON ,  Dongjoo KIM ,  Dongsik SHIN ,  Jongwook ZEONG ,  Danbi JEON ,  Dabin CHOI

    IPC: H04B1/04 ,  H01Q5/335

    Abstract: A 5th generation (5G) or pre-5G communication system for supporting a higher data transfer rate than 4th generation (4G) communication systems such as long term evolution (LTE). An apparatus for radiating a signal in a wireless communication system may include: a power amplifier; an antenna; and a combine filter unit configured to transfer an output signal of the power amplifier to the antenna. The combine filter unit may include: a first impedance matching circuit; a second impedance matching circuit; and a plurality of filters coupled in parallel between the first impedance matching circuit and the second impedance matching circuit. Allowable power of each of the plurality of filters may be lower than a maximum and/or predetermined power output of the power amplifier.

    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME
    2.
    发明申请
    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20200352060A1

    公开(公告)日：2020-11-05

    申请号：US15929394

    申请日：2020-04-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seunghwan YOON ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H05K9/00

    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME
    4.
    发明公开
    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20230225093A1

    公开(公告)日：2023-07-13

    申请号：US18185226

    申请日：2023-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seunghwan YOON ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H05K9/00 ,  H05K1/18 ,  H04B1/40

    CPC classification number: H05K9/0032 ,  H05K9/0026 ,  H05K1/181 ,  H04B1/40

    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

Patent Agency Ranking