中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

7 records (took 0.018 seconds)

    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME
    2.
    发明申请
    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20200352060A1

    公开(公告)日：2020-11-05

    申请号：US15929394

    申请日：2020-04-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seunghwan YOON ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H05K9/00

    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

    ANTENNA UNIT COMPRISING METAL PLATE AND ANTENNA FILTER UNIT
    3.
    发明申请
    ANTENNA UNIT COMPRISING METAL PLATE AND ANTENNA FILTER UNIT 有权

    公开(公告)号：US20230111873A1

    公开(公告)日：2023-04-13

    申请号：US17913656

    申请日：2021-03-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Junsig KUM ,  Seungtae KO ,  Jungyub LEE ,  Yonghun CHEON ,  Bonmin KOO ,  Youngju LEE

    IPC: H01Q21/06 ,  H01Q1/38 ,  H01Q1/48

    Abstract: The present invention relates to an antenna unit, and more particularly, to an antenna unit comprising a metal plate and an antenna filter unit. The present disclosure provides an antenna unit including a metal plate into which a stand-off head is inserted. The present disclosure provides an antenna unit including a metal plate having formed therein a groove for covering a circuit of a calibration network. The present disclosure provides an antenna unit including a filter unit having formed therein a groove for covering a circuit of a calibration network. The present disclosure provides an antenna unit comprising plastic rivets for coupling an antenna, a metal plate, and a calibration network. The present disclosure provides an antenna unit including a metal plate having a transmission line formed thereon.

    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME
    5.
    发明公开
    CONNECTION STRUCTURE FOR RADIO FREQUENCY COMPONENTS AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开

    公开(公告)号：US20230225093A1

    公开(公告)日：2023-07-13

    申请号：US18185226

    申请日：2023-03-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seunghwan YOON ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H05K9/00 ,  H05K1/18 ,  H04B1/40

    CPC classification number: H05K9/0032 ,  H05K9/0026 ,  H05K1/181 ,  H04B1/40

    Abstract: The present disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). The present disclosure relates to connection structure for radio frequency components and electronic device including same According to various embodiments, a connection assembly for radio frequency (RF) components may include: a first RF component including an opening section and a protrusion formed in the opening section; an elastic structure; a printed circuit board (PCB); and a second RF component connected to the PCB. The elastic structure may be disposed on a first surface of the PCB, a first surface of the first RF component including the opening section may be coupled to the first surface of the PCB, and the protrusion of the first RF component may come in contact with the elastic structure, thereby forming an electrical connection between the first RF component.

    CAVITY FILTER AND ANTENNA MODULE INCLUDING THE SAME
    7.
    发明申请
    CAVITY FILTER AND ANTENNA MODULE INCLUDING THE SAME 审中-公开

    公开(公告)号：US20200235484A1

    公开(公告)日：2020-07-23

    申请号：US16747887

    申请日：2020-01-21

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Dongjoo KIM ,  Bonmin KOO ,  Jonghwa KIM ,  Seungtae KO ,  Youngju LEE ,  Jongwook ZEONG

    IPC: H01Q15/00

    Abstract: The present disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The present disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. A cavity filter is provided. The cavity filter includes a plate of the cavity filter and including a feeder part for supplying an electrical signal, a housing forming an exterior of the cavity filter and coupled to the plate to form a shielded space inside the cavity filter, and a metal structure having a first end coupled to an inside of the housing and a second end that extends toward the feeder part and resonates to filter frequencies in the shielded space.

Patent Agency Ranking