公开(公告)号：US10126774B2

公开(公告)日：2018-11-13

申请号：US15666647

申请日：2017-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Won Lee ,  Jae Su Jung

IPC: G05F1/20 ,  H03L7/00 ,  G05F3/02 ,  G06F9/4401

Abstract: A semiconductor chip includes a hardware performance monitor (HPM) unit and an HPM controller. The HPM unit is driven during an initial operation period, a first operation period, and a second operation period, outputs initial HPM data, first HPM data, and second HPM data in the initial operation period, the first operation period, and the second operation period, respectively. The HPM controller performs a first compensation operation of compensating a driving voltage of the semiconductor chip using the initial HPM data and the first HPM data, and a second compensation operation of compensating the driving voltage using the initial HPM data and the second HPM data. The HPM unit provides the initial HPM data, the first HPM data, and the second HPM data, which are correlated with performance of the semiconductor chip, to the HPM controller in a first mode, and does not provide this data in a second mode.

公开(公告)号：US20180224498A1

公开(公告)日：2018-08-09

申请号：US15867890

申请日：2018-01-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Su Jung ,  Jae Won Lee

IPC: G01R31/28

CPC classification number: G01R31/2848 ,  G01R31/2837 ,  G01R31/2894 ,  G01R31/3004 ,  G01R31/3016

Abstract: A method of testing a semiconductor device includes: measuring minimum operating voltages of a plurality of semiconductor devices and operating frequencies of first and second ring oscillators included in the semiconductor devices, wherein the first ring oscillators have a first circuit configuration and the second ring oscillators have a second circuit configuration different from the first circuit configuration; generating a first model representing a correlation between operating frequencies of the first ring oscillators in the semiconductor devices and the minimum operating voltages of the semiconductor devices; generating a second model representing a correlation between operating frequencies of the second ring oscillators in the semiconductor devices and the minimum operating voltages of the semiconductor devices; measuring the operating frequencies of the first ring oscillators and the second ring oscillators included in a target semiconductor device; calculating a first measurement value using the operating frequencies of the first ring oscillators in the target semiconductor device and the first model; calculating a second measurement value using the operating frequencies of the second ring oscillators in the target semiconductor device and the second model; determining a high temperature compensation voltage of the target semiconductor device based on the first measurement value and the second measurement value; and modifying a dynamic voltage and frequency scaling (DVFS) table of the target semiconductor device according to the high temperature compensation voltage.

公开(公告)号：US20180188761A1

公开(公告)日：2018-07-05

申请号：US15666647

申请日：2017-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Won Lee ,  Jae Su Jung

IPC: G05F3/02 ,  G06F9/44

CPC classification number: G05F3/02 ,  G06F9/4411

Abstract: A semiconductor chip includes a hardware performance monitor (HPM) unit and an HPM controller. The HPM unit is driven during an initial operation period, a first operation period, and a second operation period, outputs initial HPM data, first HPM data, and second HPM data in the initial operation period, the first operation period, and the second operation period, respectively. The HPM controller performs a first compensation operation of compensating a driving voltage of the semiconductor chip using the initial HPM data and the first HPM data, and a second compensation operation of compensating the driving voltage using the initial HPM data and the second HPM data. The HPM unit provides the initial HPM data, the first HPM data, and the second HPM data, which are correlated with performance of the semiconductor chip, to the HPM controller in a first mode, and does not provide this data in a second mode.