公开(公告)号：US20180263071A1

公开(公告)日：2018-09-13

申请号：US15876679

申请日：2018-01-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ye Ji YOON ,  Jong Mu CHOI ,  Min Ho KANG ,  Jin Hyun PARK ,  Jun Hak LIM ,  Won Tae CHAE ,  Bo Kun CHOI ,  Jin Hong JEONG ,  Doo Suk KANG ,  Sun Key LEE ,  Byung Sung KIM ,  Jin Il KIM ,  Chan Woo PARK

IPC: H04W76/11 ,  H04W76/15 ,  H04W76/18

Abstract: An electronic device for supporting a connection to a wireless router of an internet of things (IoT) device is provided. The electronic device includes a transceiver, a communication interface, a processor, and a memory. The processor connects a first external device by using a first service set identifier (SSID), receives first information about the first external device from the first external device, transmits at least part of the first information and second information about the electronic device to a second external device, forwards connection information from the second external device, which includes a second SSID for wireless connection between the first external device and the electronic device, or receives a transmission request of the connection information from the second external device and transmits the connection information to the first external device, and wirelessly connects to the first external device by using the connection information.

公开(公告)号：US20180249517A1

公开(公告)日：2018-08-30

申请号：US15907019

申请日：2018-02-27

Applicant: Samsung Electronics Co., Ltd

Inventor： Jin Hyun PARK ,  Ye Ji YOON ,  Min Ho KANG ,  Jun Hak LIM ,  Won Tae CHAE ,  Jong Mu CHOI ,  Bo Kun CHOI ,  Doo Suk KANG ,  Sun Key LEE

IPC: H04W76/11 ,  H04W12/06 ,  H04W12/08 ,  H04W88/08

CPC classification number: H04W76/11 ,  H04W12/06 ,  H04W12/08 ,  H04W84/12 ,  H04W88/08

Abstract: An electronic device includes a housing, a wireless communication circuit, a wired communication interface, a processor, and a memory. The memory stores instructions that, when executed, cause the processor to connect with an external device by using the wireless communication circuit or the wired communication interface, to receive first information to set the electronic device as an access point (AP) from the external device, to receive second information on another AP from the external device, to configure the electronic device by using the first information, and to wirelessly broadcast a signal by using the wireless communication circuit, to allow wireless devices to connect to the AP.

公开(公告)号：US20180339490A1

公开(公告)日：2018-11-29

申请号：US15771378

申请日：2016-10-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jin Hyun PARK ,  Seung Hoon KAL ,  Hyung Sung KIM ,  Se Won YOOK ,  Hae Yong JUNG

IPC: B32B5/24 ,  A47G23/04

Abstract: Disclosed are a vacuum insulation material having a structure from which a folding process can be removed, a vacuum insulation material manufacturing method, and a refrigerator including the vacuum insulation material. The vacuum insulation material comprises: a core material; a first outer cover material disposed at the outside of the core material; a second outer cover material coupled to the first outer cover material so as to form an accommodation space in which the compressed core material is accommodated; and coupling parts provided at edges of the first outer cover material and the second outer cover material, wherein the length of the coupling part is 10-30 mm.

公开(公告)号：US20180031304A1

公开(公告)日：2018-02-01

申请号：US15549955

申请日：2016-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Hoon KAL ,  Se Won YOOK ,  Jin Hyun PARK ,  Hae Yong JUNG

IPC: F25D23/06 ,  F16L59/065 ,  B32B17/06 ,  B32B27/08 ,  B32B9/00

CPC classification number: F25D23/06 ,  B32B9/005 ,  B32B17/02 ,  B32B17/064 ,  B32B17/067 ,  B32B27/08 ,  B32B2262/101 ,  B32B2307/304 ,  F16L59/065 ,  F25D2201/14 ,  Y10T428/231

Abstract: Disclosed is a refrigerator including a vacuum insulation panel. The vacuum insulation panel includes a core material, a covering material disposed outside the core material to form an accommodation space in which the core material is accommodated and a first adsorbent disposed in the accommodation space to be activated at a temperature higher than room temperature and to remove at least one of gases and water present in the accommodation space.