公开(公告)号：US20190082562A1

公开(公告)日：2019-03-14

申请号：US16124836

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-ju MUN ,  Keon KUK ,  Kyong-il KIM ,  Jin-woo JUNG

IPC: H05K9/00 ,  H05K1/18 ,  H05K7/20

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

公开(公告)号：US20180168029A1

公开(公告)日：2018-06-14

申请号：US15489190

申请日：2017-04-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon KUK ,  Il-ju MUN ,  Jin-woo JUNG ,  Ji-woon YEOM

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/22

CPC classification number: H05K1/0218 ,  B05B1/00 ,  H05K3/284 ,  H05K9/0026 ,  H05K2201/0715 ,  H05K2201/09909 ,  H05K2203/0126 ,  H05K2203/013 ,  H05K2203/1344

Abstract: An electromagnetic interference (EMI) shielding structure and a manufacturing method thereof are provided. The EMI shielding structure includes a printed circuit board (PCB), a plurality of elements mounted on a region of the PCB, an insulating dam provided on a peripheral portion of the region of the PCB and covering a portion of the plurality of elements; an insulating member provided on a remaining portion of the region the PCB that is surrounded by the insulating dam and covering a remaining portion of the plurality of elements; and a shielding layer covering outer surfaces of the insulating dam and the insulating member.