公开(公告)号：US20170325365A1

公开(公告)日：2017-11-09

申请号：US15386823

申请日：2016-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon KUK ,  Il-ju MUN ,  Ji-woon YEOM ,  Yeon-kyoung JUNG ,  Kyong-il KIM

IPC: H05K9/00 ,  H05K3/30

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

公开(公告)号：US20190082562A1

公开(公告)日：2019-03-14

申请号：US16124836

申请日：2018-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-ju MUN ,  Keon KUK ,  Kyong-il KIM ,  Jin-woo JUNG

IPC: H05K9/00 ,  H05K1/18 ,  H05K7/20

Abstract: An electromagnetic interference shielding structure is provided. The electromagnetic interference shielding structure includes a shield pad and a shield can. The shield pad is configured to surround at least one circuit element mounted on a printed circuit board, and to be grounded to a ground pad formed on a printed circuit board. The shield can include an upper plate, and a sidewall extending from the upper plate and partly embedded in the shield pad.

公开(公告)号：US20170295679A1

公开(公告)日：2017-10-12

申请号：US15438008

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyong-il KIM ,  Keon KUK ,  Il-ju MUN ,  O-hyun BEAK

IPC: H05K9/00 ,  B29C45/14 ,  H05K1/18

CPC classification number: H05K9/0088 ,  B29C45/14639 ,  B29K2101/12 ,  B29L2031/3425 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H01L2224/81

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

公开(公告)号：US20190166731A1

公开(公告)日：2019-05-30

申请号：US16262080

申请日：2019-01-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon KUK ,  Il-ju MUN ,  Ji-woon YEOM ,  Yeon-kyoung JUNG ,  Kyong-il KIM

IPC: H05K9/00 ,  H05K3/30

Abstract: A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.