公开(公告)号：US20230369282A1

公开(公告)日：2023-11-16

申请号：US18052252

申请日：2022-11-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Donguk Kim ,  Jitaek Oh

IPC: H01L23/00 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/49 ,  H01L24/48 ,  H01L25/0657 ,  H01L23/3128 ,  H01L24/85 ,  H01L2224/48227 ,  H01L2224/49052 ,  H01L2225/06562 ,  H01L2225/0651 ,  H01L2224/85986

Abstract: Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a substrate including substrate pads, a first semiconductor chip mounted on the substrate and including first chip pads arranged in a first direction of the first semiconductor chip, and a first wire group that connects the substrate pads to the first chip pads and includes a first power/ground wire, a first signal wire, a second signal wire, and a second power/ground wire that are arranged in a second direction that is orthogonal to the first direction. A first top end of the first signal wire is closer horizontally to the first chip pads than is a second top end of the second signal wire.

公开(公告)号：US20240266276A1

公开(公告)日：2024-08-08

申请号：US18474336

申请日：2023-09-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jinmo Kwon ,  Jitaek Oh ,  Hyoungjoon Kim

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204

Abstract: A strip substrate comprises a dielectric layer comprising a unit region and a saw line region, a saw line pattern on the saw line region, a conductive dummy pattern extending from the saw line pattern and toward the unit region, and power/ground patterns on the unit region. The power/ground pattern includes a first lateral surface that extends in a first direction and is proximate to the saw line pattern, a second lateral surface that extends in a second direction and is proximate to the conductive dummy pattern, and a third lateral surface that connects the first lateral surface and the second lateral surface.