公开(公告)号：US20250155810A1

公开(公告)日：2025-05-15

申请号：US18929891

申请日：2024-10-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jiyup KIM ,  Beomgoo KANG ,  Songse YI ,  Dabin KIM ,  Woojae JANG

IPC: G03F7/039 ,  C08F212/14 ,  G03F7/00 ,  G03F7/20 ,  H01L21/027

Abstract: A photosensitive polymer may include repeating units represented by Formula 1 and may have a polydispersity index (PDI) of 1.1 or less.
In Formula 1, R1, R2, R3, R4, R5, R6, R7, and R8 each independently may be a hydrogen atom, a C1-C3 linear or branched alkyl group, a substituted or unsubstituted C2-C3 linear or branched alkenyl group, a substituted or unsubstituted C2-C3 linear or branched alkynyl group, a substituted or unsubstituted C1-C3 alkoxy group, or a halogen element; A may be an acid-labile group having an acid desorption rate lower than that of a trialkylsilyl group; and m and n each may be an integer of 1 or more.

公开(公告)号：US20230288806A1

公开(公告)日：2023-09-14

申请号：US18098233

申请日：2023-01-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyup KIM ,  Hyunwoo KIM ,  Sung Hwan PARK ,  Juhyeon PARK ,  Giyoung SONG

IPC: G03F7/039 ,  G03F7/004 ,  C08F220/28 ,  C08F216/10 ,  H01L21/027

CPC classification number: G03F7/0397 ,  C08F216/10 ,  C08F220/283 ,  G03F7/0045 ,  H01L21/0274

Abstract: A photosensitive polymer includes a first repeating unit represented by Formula 1 below:





wherein, in Formula 1, R1 is a hydrogen atom or a methyl group, R2 is a substituted or unsubstituted C1 to C30 acid-labile hydrocarbylene group having a tertiary carbon atom, R3 is a C1 to C10 linear or branched alkyl group, a C3 to C30 tertiary alicyclic group, a C6 to C20 aryl group, a C2 to C20 heteroaryl group, a C7 to C20 arylalkyl group, or a C2 to C20 heteroarylalkyl group, and n is 0 or 1. To manufacture an integrated circuit (IC) device, a change in the polarity of the photosensitive polymer is induced by causing a multi-step deprotection reaction of the first repeating unit.

公开(公告)号：US20230131429A1

公开(公告)日：2023-04-27

申请号：US17730532

申请日：2022-04-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyup KIM ,  Hyunwoo KIM ,  Hyun-Ji SONG ,  Juyoung KIM ,  Jinjoo KIM ,  Sunghwan PARK ,  Giyoung SONG

IPC: G03F7/004 ,  C07C381/12 ,  C07C309/12 ,  H01L21/027

Abstract: A photo-decomposable compound, a photoresist composition including the photo-decomposable compound, and a method of manufacturing an integrated circuit (IC) device using the photoresist composition, the photo-decomposable compound including a phenyl sulfonium cation component; and an anion component, wherein the phenyl sulfonium cation component has a protecting group, which is decomposable by an action of acid to generate an alkali-soluble group in response to exposure, the anion component generates acid in response to exposure, the protecting group is represented by *—C(═O)OR, in which R is a substituted or unsubstituted t-butyl group or a substituted or unsubstituted C3 to C30 alicyclic group, and * is a bonding site, and the protecting group is bonded to a phenyl group of the phenyl sulfonium cation component through an ether linking group.