公开(公告)号：US20240222848A1

公开(公告)日：2024-07-04

申请号：US18517123

申请日：2023-11-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Hyuck LEE ,  Hae Yeon KIM ,  Se Hyun PARK

IPC: H01Q1/24 ,  H01Q5/321 ,  H01Q5/335 ,  H01Q5/50 ,  H01Q9/42

CPC classification number: H01Q1/243 ,  H01Q5/321 ,  H01Q5/335 ,  H01Q5/50 ,  H01Q9/42

Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes an antenna element including at least a portion of a housing of the electronic device and configured to resonate in a first frequency band, a conductive plate electrically connected with the antenna element, positioned within the housing, and configured to resonate in the first frequency band or in a second frequency band higher than the first frequency band, a filter circuit electrically connected with the conductive plate and having a pass band in the second frequency band, and a conductive member electrically connected with the conductive plate through the filter circuit and configured to resonate in the second frequency band. Moreover, various embodiment found through the disclosure are possible.

公开(公告)号：US20230420829A1

公开(公告)日：2023-12-28

申请号：US18464971

申请日：2023-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Hyuck LEE ,  Sehyun PARK ,  Jae-Bong CHUN

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q21/28 ,  H01Q9/04

CPC classification number: H01Q1/245 ,  H01Q21/067 ,  H01Q21/28 ,  H01Q1/243 ,  H01Q9/0407 ,  H01Q21/062 ,  H01Q21/065

Abstract: According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit.

公开(公告)号：US20190165454A1

公开(公告)日：2019-05-30

申请号：US16201500

申请日：2018-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Hyuck LEE ,  Sehyun PARK ,  Jae-Bong CHUN

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q9/04

Abstract: According to various embodiments, an electronic device includes: a housing including: a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.

公开(公告)号：US20190334225A1

公开(公告)日：2019-10-31

申请号：US16320169

申请日：2017-05-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Hyuck LEE ,  Hae Yeon KIM ,  Se Hyun PARK

IPC: H01Q1/24 ,  H01Q5/321 ,  H01Q5/50 ,  H01Q9/42 ,  H01Q5/335

Abstract: Disclosed is an electronic device. The electronic device according to an embodiment includes an antenna element including at least a portion of a housing of the electronic device and configured to resonate in a first frequency band, a conductive plate electrically connected with the antenna element, positioned within the housing, and configured to resonate in the first frequency band or in a second frequency band higher than the first frequency band, a filter circuit electrically connected with the conductive plate and having a pass band in the second frequency band, and a conductive member electrically connected with the conductive plate through the filter circuit and configured to resonate in the second frequency band. Moreover, various embodiment found through the disclosure are possible.

公开(公告)号：US20210075091A1

公开(公告)日：2021-03-11

申请号：US17099615

申请日：2020-11-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Hyuck LEE ,  Sehyun PARK ,  Jae-Bong CHUN

IPC: H01Q1/24 ,  H01Q21/06 ,  H01Q21/28 ,  H01Q9/04

Abstract: According to various embodiments, an electronic device includes a housing including a front surface plate; a rear surface plate facing toward the opposite direction of the front surface plate; and a side surface member surrounding a space between the front surface plate and the rear surface plate, the side surface member having a substantially rectangular shape when viewed above the front surface plate; a first PCB arranged in the space; a first wireless communication circuit; a substrate; a first antenna array protruding from the first side of the substrate toward the first portion; a second antenna array protruding from the second side of the substrate toward the second portion; and a second wireless communication circuit. Various other embodiments are possible.

公开(公告)号：US20190052292A1

公开(公告)日：2019-02-14

申请号：US16103440

申请日：2018-08-14

Applicant: Samsung Electronics Co., Ltd

Inventor： Min Cheol SEO ,  Him Chan YUN ,  Ho Jung NAM ,  Joon Ho BYUN ,  Yoon Jae LEE ,  Jong Hyuck LEE

IPC: H04B1/00 ,  H01Q1/48 ,  H01Q5/378 ,  H01Q21/00

Abstract: An electronic device is provided and includes a housing, a support member including a first ground region, a printed circuit board including a second ground region, a plurality of switches electrically connecting the first ground region and the second ground region, a first antenna element including at least a portion of a first edge of the housing and electrically connected with the first ground region of the support member, a second antenna element including at least a portion of a second edge of the housing and electrically connected with the second ground region of the printed circuit board, and a wireless communication circuit configured to transmit/receive in a first frequency band based on a first electrical path, transmit/receive in a second frequency band based on a second electrical path, set ON/OF states of the plurality of switches to a first arrangement and a second arrangement, wherein at least one switch of the plurality of switches is set to an ON state in each of the first arrangement and the second arrangement.