公开(公告)号：US10728640B2

公开(公告)日：2020-07-28

申请号：US16033652

申请日：2018-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yo-Han Lee ,  Jung-Kyun Ryu ,  Jun-Ho Park ,  Won-Sik Song ,  Jong-Chan Won ,  Seung-Yong Lee ,  Young-Su Lee ,  Bo-Kun Choi ,  Chang-Ryong Heo

IPC: H04R1/02 ,  F21V33/00 ,  H04R9/02 ,  H04R1/34 ,  H05B45/20 ,  H04R1/08 ,  G10L17/00 ,  G10L15/22 ,  F21K9/23 ,  F21V29/70 ,  F21Y115/10

Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.

公开(公告)号：US20190020938A1

公开(公告)日：2019-01-17

申请号：US16033652

申请日：2018-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yo-Han LEE ,  Jung-Kyun Ryu ,  Jun-Ho Park ,  Won-Sik Song ,  Jong-Chan Won ,  Seung-Yong Lee ,  Young-Su Lee ,  Bo-Kun Choi ,  Chang-Ryong Heo

IPC: H04R1/02 ,  F21V33/00 ,  H05B33/08 ,  H04R1/34 ,  H04R1/08 ,  G10L17/00 ,  G10L15/22 ,  H04R9/02

Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.