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公开(公告)号：US09269810B2
公开(公告)日：2016-02-23
申请号：US14444155
申请日：2014-07-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung-Uk Han , Won-Kyung Park , Jun-Ho Park , Jun-Hee Lim , Ki-Jae Hur
IPC: G11C5/02 , H01L29/78 , H01L27/088 , G11C7/06 , G11C16/26 , G11C11/4091
CPC classification number: H01L29/7835 , G11C5/025 , G11C7/065 , G11C11/4091 , G11C16/26 , H01L21/823437 , H01L27/0207 , H01L27/088
Abstract: A semiconductor device includes an active region defined on a substrate, a gate electrode disposed on the active region and covering two adjacent corners of the active region, a drain area formed in the active region adjacent to a first side of the gate electrode, and a source area formed in the active region adjacent to a second side of the gate electrode. The first and second sides of the gate electrode are spaced apart from each other, and the first side has a bent shape.
Abstract translation: 半导体器件包括限定在衬底上的有源区，设置在有源区上并覆盖有源区的两个相邻角的栅电极，形成在与栅电极的第一侧相邻的有源区中的漏区，以及 源极区域形成在与栅电极的第二侧相邻的有源区域中。 栅电极的第一和第二侧彼此间隔开，第一侧具有弯曲形状。
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公开(公告)号：US10728640B2
公开(公告)日：2020-07-28
申请号：US16033652
申请日：2018-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yo-Han Lee , Jung-Kyun Ryu , Jun-Ho Park , Won-Sik Song , Jong-Chan Won , Seung-Yong Lee , Young-Su Lee , Bo-Kun Choi , Chang-Ryong Heo
IPC: H04R1/02 , F21V33/00 , H04R9/02 , H04R1/34 , H05B45/20 , H04R1/08 , G10L17/00 , G10L15/22 , F21K9/23 , F21V29/70 , F21Y115/10
Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.
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公开(公告)号：US20190020938A1
公开(公告)日：2019-01-17
申请号：US16033652
申请日：2018-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yo-Han LEE , Jung-Kyun Ryu , Jun-Ho Park , Won-Sik Song , Jong-Chan Won , Seung-Yong Lee , Young-Su Lee , Bo-Kun Choi , Chang-Ryong Heo
Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.
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公开(公告)号：US10306402B2
公开(公告)日：2019-05-28
申请号：US14979783
申请日：2015-12-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Byung-Chang Kwak , Jun-Ho Park
Abstract: The present disclosure provides a method and an apparatus for providing notification information. The method includes identifying terminal location information in an area including a terminal; identifying at least one piece of setting location information in an area which is set by a user; providing corresponding first notification information when there occurs a notification event corresponding to the terminal location information; and providing at least one piece of corresponding second notification information when there occurs a notification event corresponding to the at least one piece of setting location information.
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