公开(公告)号：US20190020938A1

公开(公告)日：2019-01-17

申请号：US16033652

申请日：2018-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yo-Han LEE ,  Jung-Kyun Ryu ,  Jun-Ho Park ,  Won-Sik Song ,  Jong-Chan Won ,  Seung-Yong Lee ,  Young-Su Lee ,  Bo-Kun Choi ,  Chang-Ryong Heo

IPC: H04R1/02 ,  F21V33/00 ,  H05B33/08 ,  H04R1/34 ,  H04R1/08 ,  G10L17/00 ,  G10L15/22 ,  H04R9/02

Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.

公开(公告)号：US11551683B2

公开(公告)日：2023-01-10

申请号：US16756894

申请日：2018-10-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yo-Han Lee ,  Jung-Kyun Ryu ,  Jun Ho Park ,  Won-Sik Song ,  Jong Chan Won ,  Seungyong Lee ,  Young-Su Lee

IPC: G10L15/00 ,  G10L21/00 ,  G06F1/26 ,  G10L15/22 ,  G06F1/3231 ,  G06F1/3287 ,  G10L25/51

Abstract: Various embodiments of the present invention pertain to an electronic device and an operation method therefor. The electronic device comprises: a housing that includes a circular upper end surface comprising a plurality of openings having a selected pattern, a flat circular lower end surface and a side surface surrounding a space between the upper end surface and the lower end surface; an audio output interface that is formed on the side surface; a power input interface that is formed on the side surface; a microphone that is located inside the housing, and that faces the openings; a wireless communication circuit; a processor that is operatively connected to the audio output interface, the power input interface, the microphone and the communication circuit; and a memory that is operatively connected to the processor, wherein the memory, when the electronic device is executed, can store instructions for the processor to receive a wake-up command through the microphone, to recognize the wake-up command, to transmit to a server information regarding reception of the wake-up command using the communication circuit, to receive a response from the server using the communication circuit, to generate a first audio signal based on the response, and to output the first audio signal using the audio output interface when the microphone is available, wherein the audio signal can be a non-language sound. Various embodiments are also possible.

公开(公告)号：US10728640B2

公开(公告)日：2020-07-28

申请号：US16033652

申请日：2018-07-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yo-Han Lee ,  Jung-Kyun Ryu ,  Jun-Ho Park ,  Won-Sik Song ,  Jong-Chan Won ,  Seung-Yong Lee ,  Young-Su Lee ,  Bo-Kun Choi ,  Chang-Ryong Heo

IPC: H04R1/02 ,  F21V33/00 ,  H04R9/02 ,  H04R1/34 ,  H05B45/20 ,  H04R1/08 ,  G10L17/00 ,  G10L15/22 ,  F21K9/23 ,  F21V29/70 ,  F21Y115/10

Abstract: An electronic device with a heat radiation structure using an audio device is provided. The electronic device includes a first housing, a speaker module disposed on a surface of the first housing and configured to output sounds in a first direction, a sound reflection plate mounted above the surface of the first housing and having a first surface facing the speaker module, and a heat emission device disposed on a second surface of the sound reflection plate. The sound reflection plate may absorb heat generated from the heat emission device, and discharge the absorbed heat to the outside of the electronic device through a space between the surface of the first housing and the first surface of the sound reflection plate.