公开(公告)号：US20190013401A1

公开(公告)日：2019-01-10

申请号：US16128152

申请日：2018-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Min KIM ,  Kyung-Seok OH ,  Cheol KIM ,  Heon-Jong SHIN ,  Jong-Ryeol YOO ,  Hyun-Jung LEE ,  Seong-Hoon JEONG

IPC: H01L29/78 ,  H01L27/12 ,  H01L21/84 ,  H01L29/66

Abstract: Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a lower fin that protrudes from a substrate and extends in a first direction, an oxide film the lower fin, an upper fin that protrudes from the oxide film and that is spaced apart from the lower fin at a position corresponding to the lower fin, and a gate structure the upper fin that extends in a second direction to intersect the upper fin, wherein germanium (Ge) is included in a portion of the oxide film located between the lower fin and the upper fin.