METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
    1.
    发明申请
    METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES 有权
    制造半导体器件的方法

    公开(公告)号:US20160035788A1

    公开(公告)日:2016-02-04

    申请号:US14659806

    申请日:2015-03-17

    Abstract: Active patterns spaced apart from each other by an isolation layer are formed in a substrate. Gate structures extending in the isolation layer through the active patterns are formed. Each active pattern is divided into a central portion and a peripheral portion facing the central portion by the gate structures. A protrusion of at least one of active pattern is formed. The protrusion is exposed from a top surface of the isolation layer, and transformed into silicide such that a first silicide ohmic pad is formed at the central portion of the active pattern and a second silicide ohmic pad is formed at the peripheral portion of the active pattern. A conductive line structure electrically connected to the first silicide ohmic pad is formed. A conductive contact electrically connected to the second silicide ohmic pad is formed. A data storage unit electrically connected to the conductive contact is formed.

    Abstract translation: 在衬底中形成通过隔离层彼此间隔开的有源图案。 形成通过有源图案在隔离层中延伸的门结构。 每个活动图案被门结构分成中心部分和面向中心部分的周边部分。 形成有源图案中的至少一个的突起。 突起从隔离层的顶表面露出,并转变为硅化物,使得在有源图案的中心部分处形成第一硅化物欧姆垫,并且在活性图案的周边部分形成第二硅化物欧姆垫 。 形成电连接到第一硅化物欧姆垫的导电线结构。 形成电连接到第二硅化物欧姆垫的导电接触。 形成与导体接触部电连接的数据存储部。

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