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公开(公告)号：US20230012838A1
公开(公告)日：2023-01-19
申请号：US17888889
申请日：2022-08-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyungwoo Lee , Jongchun Wee , Byounguk Yoon
Abstract: A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.
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Patent Agency Ranking
公开(公告)号：US12052536B2
公开(公告)日：2024-07-30
申请号：US18460209
申请日：2023-09-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungsoo Jun , Namjun Kim , Sejin Kim , Youngmoon Park , Youngkyu Kim , Jongchun Wee , Hwanseok Choi , Byounguk Yoon
IPC: H04R1/02 , H04N23/51 , H04N23/54 , H04B1/3827
CPC classification number: H04R1/028 , H04N23/51 , H04N23/54 , H04B1/3827 , H04R2499/11 , H04R2499/15
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface member enclosing the first surface and the second surface, a display visible through at least a portion of the first surface, an opening formed on a portion of the first surface, a speaker positioned within the housing, a sensor positioned within the housing, and a first path configured to guide a sound of the speaker to the opening, and a second path configured to guide the sound of the speaker to the opening and to avoid overlapping the first path, and at least a portion of the sensor is positioned between the first path and the second path.
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公开(公告)号：US11962960B2
公开(公告)日：2024-04-16
申请号：US17888889
申请日：2022-08-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Hyungwoo Lee , Jongchun Wee , Byounguk Yoon
CPC classification number: H04R1/023 , H04R1/025 , H04R1/04 , H04R1/086 , H04R3/00 , H04R2201/029 , H04R2400/11 , H04R2499/11
Abstract: A sound component assembly includes: a sealing portion provided in a sound passage connected to a sound hole of an electronic device to surround a portion of the sound passage and contact at least a portion of a printed circuit board (PCB) having a sound module mounted thereon; and a cover portion disposed to face the PCB outside the sealing portion, wherein the sealing portion may include a first material, the cover portion may include a second material, and the second material may have a greater hardness than a hardness of the first material.
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公开(公告)号：US11324135B2
公开(公告)日：2022-05-03
申请号：US16794830
申请日：2020-02-19
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hosu Kim , Jongchun Wee , Kyungpil Kim , Namjun Kim
Abstract: An electronic device is provided, which includes a housing including a sidewall; a through-hole configured to penetrate the sidewall; an assembling hole formed adjacent to the through-hole inside the housing; a key assembly configured to be received in the assembling hole and disposed to face an inner surface of the housing in an area where the through-hole is positioned; and a fixing member configured to be received in the assembling hole and to bring a surface of the key assembly into close contact with the inner surface of the housing around the through-hole and seal between the through-hole and an inner space of the housing.
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公开(公告)号：US12150255B2
公开(公告)日：2024-11-19
申请号：US17573773
申请日：2022-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sungsoo Jun , Bumsun Park , Beomju Kim , Changho Park , Youngkyu Kim , Jongchun Wee , Hwanseok Choi , Minwoo Yoo
Abstract: An electronic device includes a housing including a front plate, a rear plate, a first support member, at least a portion of which is disposed between the front plate and the rear plate, and a second support member which faces the first support member, a display including a first display surface visually exposed to an exterior of the electronic device, and a second display surface which is opposite to the first display surface, a first connector mounted on the second display surface, a main printed circuit board disposed in the housing, and a first flexible printed circuit board connected to the main printed circuit board, where the first flexible printed circuit board includes a second connector facing the second support member and connected to the first connector.
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公开(公告)号：US11750958B2
公开(公告)日：2023-09-05
申请号：US17159826
申请日：2021-01-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sungsoo Jun , Namjun Kim , Sejin Kim , Youngmoon Park , Youngkyu Kim , Jongchun Wee , Hwanseok Choi , Byounguk Yoon
IPC: H04R1/02 , H04N23/51 , H04N23/54 , H04B1/3827
CPC classification number: H04R1/028 , H04N23/51 , H04N23/54 , H04B1/3827 , H04R2499/11 , H04R2499/15
Abstract: An electronic device is provided. The electronic device includes a housing including a first surface facing in a first direction, a second surface facing in a second direction opposite to the first direction, and a side surface member enclosing the first surface and the second surface, a display visible through at least a portion of the first surface, an opening formed on a portion of the first surface, a speaker positioned within the housing, a sensor positioned within the housing, and a first path configured to guide a sound of the speaker to the opening, and a second path configured to guide the sound of the speaker to the opening and to avoid overlapping the first path, and at least a portion of the sensor is positioned between the first path and the second path.
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