公开(公告)号：US20190319381A1

公开(公告)日：2019-10-17

申请号：US16384465

申请日：2019-04-15

申请人： Samsung Electronics Co., Ltd.

发明人： Jungje BANG ,  Seungju KIM ,  Taewoo KIM ,  Bongkyu MIN ,  Bongchoon PARK ,  Jonggu PARK ,  Jonghan PARK ,  Jinyong PARK ,  Hoyeon SEO ,  Jaeheung YE ,  Hyelim YUN ,  Hyeongju LEE ,  Hyoungsoo JUNG

IPC分类号： H01R12/71 ,  H01R13/41 ,  H01R13/6596 ,  H05K7/14 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

摘要： An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component. The first electronic component is electrically shielded against an outside of the space by the first ground of the first board, the second ground of the second board, and the metal plate.