公开(公告)号：US20230119170A1

公开(公告)日：2023-04-20

申请号：US18084994

申请日：2022-12-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngsun LEE ,  Dohyeon KIM ,  Byeongkeol KIM ,  Jinsu KIM ,  Seokjoon PARK ,  Jungje BANG ,  Hoyeon SEO ,  Jongbum LEE ,  Jongmin JEON

IPC: H05K1/14 ,  B32B7/12 ,  B32B3/26

Abstract: An electronic device including a thermosetting bonding sheet may include: a base substrate including a base substrate body and a plurality of base pads disposed on the base substrate body, a connection substrate including a connection substrate body facing the base substrate body, a plurality of connection pads disposed on the connection substrate body and including a pad hole, and a plurality of connection lines disposed on the connection substrate body and connected to the plurality of connection pads, a solder, at least a portion of which is inserted into the pad hole, disposed on the base pad and configured to electrically connect the base pad to the connection pad, and a thermosetting bonding sheet provided between the base substrate body and the connection substrate body, bonded to the base substrate body and the connection substrate body, and enclosing the solder

公开(公告)号：US20190319381A1

公开(公告)日：2019-10-17

申请号：US16384465

申请日：2019-04-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungje BANG ,  Seungju KIM ,  Taewoo KIM ,  Bongkyu MIN ,  Bongchoon PARK ,  Jonggu PARK ,  Jonghan PARK ,  Jinyong PARK ,  Hoyeon SEO ,  Jaeheung YE ,  Hyelim YUN ,  Hyeongju LEE ,  Hyoungsoo JUNG

IPC: H01R12/71 ,  H01R13/41 ,  H01R13/6596 ,  H05K7/14 ,  H05K1/14 ,  H05K1/18 ,  H05K1/02

Abstract: An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component. The first electronic component is electrically shielded against an outside of the space by the first ground of the first board, the second ground of the second board, and the metal plate.