公开(公告)号：US11004712B2

公开(公告)日：2021-05-11

申请号：US16532920

申请日：2019-08-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Yoon Ryu ,  Joonseo Song ,  Souk Kim ,  Younghoon Sohn ,  Yusin Yang ,  Chihoon Lee

IPC: H01L21/67 ,  G01B11/24 ,  G06T7/00

Abstract: Disclosed are methods of inspecting semiconductor wafers, inspection systems for performing the same, and methods of fabricating semiconductor devices using the same. A method of inspecting a semiconductor wafer including preparing a wafer including zones each having patterns, obtaining representative values for the patterns, scanning the patterns under an optical condition to obtain optical signals for the patterns, each of the optical signals including optical parameters, selecting a representative optical parameter that is one of the optical parameters that has a correlation with the representative values, obtaining a reference value of the representative optical parameter for a reference pattern, and obtaining a defect of an inspection pattern by comparing the reference value with an inspection value of the representative optical parameter for the inspection pattern.

公开(公告)号：US10269111B2

公开(公告)日：2019-04-23

申请号：US15597262

申请日：2017-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonseo Song ,  Sung Yoon Ryu ,  Wahseng Yap ,  Yunjung Jee ,  Yusin Yang ,  Chungsam Jun ,  Yoo Jin Jeoung ,  Jaehyung Ahn ,  Janghee Lee

IPC: G06T7/00

Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.

公开(公告)号：US20180053292A1

公开(公告)日：2018-02-22

申请号：US15597262

申请日：2017-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Joonseo Song ,  Sung Yoon Ryu ,  Wahseng Yap ,  Yunjung Jee ,  Yusin Yang ,  Chungsam Jun ,  Yoo Jin Jeoung ,  Jaehyung Ahn ,  Janghee Lee

IPC: G06T7/00

CPC classification number: G06T7/001 ,  G06T2207/30148

Abstract: A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.