公开(公告)号：US20230354538A1

公开(公告)日：2023-11-02

申请号：US18348661

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanju JEON ,  Jungmin YEO ,  Kyuin LEE ,  Junsang PARK ,  Sunghoon CHO

IPC: H05K5/03 ,  H05K9/00

CPC classification number: H05K5/03 ,  H05K9/0007

Abstract: A cover plate for an electronic device may include: a first layer including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a specified type of fiber disposed between the first and second surfaces; and a second layer having a specified RF shielding effectiveness and disposed in the second direction with respect to the first layer. Various other embodiments are also possible.

公开(公告)号：US20220024815A1

公开(公告)日：2022-01-27

申请号：US17311390

申请日：2019-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sejin KIM ,  Jinchoul PARK ,  Junsang PARK ,  Wanju SHIN ,  Hwanju JEON ,  Younggoo KANG ,  Yoojin KIM ,  Gijea PARK ,  Yunhui CHO

IPC: C03C17/34 ,  H05K5/03 ,  G02B5/00

Abstract: An electronic device according to various embodiments of the disclosure may include a housing including a first plate forming an outer face. The first plate may include a glass plate including a first surface outwardly facing the housing and a second surface inwardly facing the housing, a coating layer including an anti-reflection coating and/or an anti-finger coating above the first surface while forming the outer face, a first layer formed between the first surface of the first glass plate and the coating layer, having a first thickness, and including a first inorganic material, a second layer formed between the first layer and the coating layer, having a second thickness, and including a second inorganic material different from the first inorganic material, a third layer formed between the second layer and the coating layer, having a third thickness thicker than each of the first thickness and the second thickness, and including a third inorganic material, and an opaque layer formed on the second surface. Various other embodiments may also be possible.