公开(公告)号：US20250107012A1

公开(公告)日：2025-03-27

申请号：US18903540

申请日：2024-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanju JEON

IPC: H05K5/00 ,  A61B5/00 ,  A61B5/01 ,  H01F7/02 ,  H05K5/02

Abstract: An electronic device according to an embodiment of the disclosure may include: a housing including a coupling part configured to be be detachably coupled to a ring-shaped external device, wherein the coupling part includes a first coupling surface, a second coupling surface extending from one side of the first coupling surface, a third coupling surface extending from an other side of the first coupling surface, and a connection terminal formed on at least one of the first coupling surface, the second coupling surface, and the third coupling surface and configured to electrically connect the electronic device with the external device based on the electronic device being coupled to the external device, and based on the electronic device being coupled with the external device, the first coupling surface is disposed to face an outer surface facing in a direction opposite to an inner surface of the external device, and the second coupling surface and the third coupling surface are arranged to face a side surface formed between the inner surface and the outer surface of the external device.

公开(公告)号：US20220382333A1

公开(公告)日：2022-12-01

申请号：US17883259

申请日：2022-08-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hwanju JEON ,  Jungtaek LEE ,  Sunghoon CHO ,  Sunyoung JI

IPC: G06F1/16 ,  G02B1/14 ,  G02B1/04 ,  B41M3/00 ,  B41M1/34

Abstract: An electronic device includes a housing including a translucent ceramic member; and a printing film provided on the housing, wherein the printing film includes: an adhesive layer provided on the ceramic member; a base layer including a first surface facing the adhesive layer and a second surface opposite to the first surface; a printing layer provided on the first surface or the second surface of the base layer, the printing layer being viewable through the ceramic member and the adhesive layer; and a shielding printing layer facing the second surface of the base layer.

公开(公告)号：US20230354538A1

公开(公告)日：2023-11-02

申请号：US18348661

申请日：2023-07-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwanju JEON ,  Jungmin YEO ,  Kyuin LEE ,  Junsang PARK ,  Sunghoon CHO

IPC: H05K5/03 ,  H05K9/00

CPC classification number: H05K5/03 ,  H05K9/0007

Abstract: A cover plate for an electronic device may include: a first layer including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a specified type of fiber disposed between the first and second surfaces; and a second layer having a specified RF shielding effectiveness and disposed in the second direction with respect to the first layer. Various other embodiments are also possible.

公开(公告)号：US20220024815A1

公开(公告)日：2022-01-27

申请号：US17311390

申请日：2019-12-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sejin KIM ,  Jinchoul PARK ,  Junsang PARK ,  Wanju SHIN ,  Hwanju JEON ,  Younggoo KANG ,  Yoojin KIM ,  Gijea PARK ,  Yunhui CHO

IPC: C03C17/34 ,  H05K5/03 ,  G02B5/00

Abstract: An electronic device according to various embodiments of the disclosure may include a housing including a first plate forming an outer face. The first plate may include a glass plate including a first surface outwardly facing the housing and a second surface inwardly facing the housing, a coating layer including an anti-reflection coating and/or an anti-finger coating above the first surface while forming the outer face, a first layer formed between the first surface of the first glass plate and the coating layer, having a first thickness, and including a first inorganic material, a second layer formed between the first layer and the coating layer, having a second thickness, and including a second inorganic material different from the first inorganic material, a third layer formed between the second layer and the coating layer, having a third thickness thicker than each of the first thickness and the second thickness, and including a third inorganic material, and an opaque layer formed on the second surface. Various other embodiments may also be possible.

公开(公告)号：US20210355574A1

公开(公告)日：2021-11-18

申请号：US17286795

申请日：2019-10-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyejin BANG ,  Hwanju JEON

IPC: C23C14/08 ,  C23C14/28 ,  C23C14/34 ,  B32B17/06 ,  B32B7/12

Abstract: A cover member of an electronic device according to various embodiments of the present disclosure may comprise: a substrate film layer; a metal oxide layer disposed on the upper surface of the substrate film layer and formed by sputtering; a transparent member attached/disposed on the upper surface of the metal oxide layer; a primer layer disposed on the lower surface of the substrate film layer and made of a semi-transparent material; and a photocurable resin layer disposed on the lower surface of the primer layer, the photocurable resin layer comprising, on a surface thereof, a pattern structure in a designated stereoscopic shape. Other embodiments are also possible.