公开(公告)号：US20170309606A1

公开(公告)日：2017-10-26

申请号：US15489031

申请日：2017-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan LEE ,  Kundae YEOM ,  Jongho LEE ,  Hogeon SONG

IPC: H01L25/18 ,  H01L25/10 ,  H01L25/065 ,  H01L21/48 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L25/18 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L24/16 ,  H01L25/0652 ,  H01L25/105 ,  H01L2224/16141 ,  H01L2225/06517 ,  H01L2225/06572

Abstract: In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.

公开(公告)号：US20220093673A1

公开(公告)日：2022-03-24

申请号：US17306267

申请日：2021-05-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Raehyung DO ,  Jongho LEE ,  Kundae YEOM

IPC: H01L27/146 ,  H05K3/40 ,  H05K1/03 ,  H04N5/374

Abstract: An image sensor package includes a circuit board, an image sensor chip on the circuit board, a stack bump structure on the image sensor chip, a bonding wire connecting the circuit board to the stack bump structure, a dam element on the image sensor chip and covering both the stack bump structure and the bonding wire, and a molding element contacting the dam element on the circuit board and covering both the image sensor chip and the bonding wire.