公开(公告)号：US20140264052A1

公开(公告)日：2014-09-18

申请号：US14197608

申请日：2014-03-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woong-Kyu SON ,  Kwang-Hoon KIM ,  Deok-Yong KIM ,  Sung-Soo MOON ,  Jung-Hoon BYUN ,  Ji-Hye LEE ,  Choon-Shik LEEM ,  Soo-Bok CHIN

IPC: G01N21/33 ,  G01N21/21

CPC classification number: H01L22/12 ,  G01N21/21 ,  G01N21/33 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8848 ,  G03F7/70625

Abstract: The inventive concept provides apparatuses and methods for monitoring semiconductor fabrication processes in real time using polarized light. In some embodiments, the apparatus comprises a light source configured to generate light, a beam splitter configured to reflect the light toward the wafer being processed, an objective polarizer configured to polarize the light reflected toward the wafer and to allow light reflected by the wafer to pass therethrough, a blaze grating configured to separate light reflected by the wafer according to wavelength, an array detector configured to detect the separated light and an analyzer to analyze the three-dimensional profile of the structure/pattern being formed in the wafer.

Abstract translation: 本发明的概念提供了使用偏振光来实时监控半导体制造工艺的装置和方法。 在一些实施例中，该装置包括被配置为产生光的光源，被配置为将光朝向正被处理的晶片反射的分束器，物镜偏振器，被配置为使朝向晶片反射的光偏振，并允许由晶片反射的光 通过其配置成根据波长分离由晶片反射的光的火焰光栅，被配置为检测分离的光的阵列检测器和分析器，以分析在晶片中形成的结构/图案的三维轮廓。

公开(公告)号：US20150010133A1

公开(公告)日：2015-01-08

申请号：US14248673

申请日：2014-04-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung Hyun HWANG ,  Kwang-Hoon KIM ,  Woongkyu SON ,  CHULGI SONG ,  CHOONSHIK LEEM

IPC: G01B15/02 ,  G01N23/20

CPC classification number: G01B15/02 ,  G01N23/20

Abstract: A method for analyzing an object includes measuring a first reflectivity of light from a surface and measuring a second reflectivity of light from the object, after the object is formed on the surface. A variation between the first and second reflectivities is calculated, and the variation is transformed by a predetermined transform. A thickness of the object is determined based on the transformed variation.

Abstract translation: 用于分析物体的方法包括在物体形成在表面上之后测量来自表面的光的第一反射率和测量来自物体的光的第二反射率。 计算第一和第二反射率之间的变化，并且通过预定变换来变换变化。 基于变换的变化确定对象的厚度。

公开(公告)号：US20160196356A1

公开(公告)日：2016-07-07

申请号：US14979796

申请日：2015-12-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang-Hoon KIM ,  Man-Keun SEO ,  Sang-Kyoo JEONG

IPC: G06F17/30

CPC classification number: G06F17/30519

Abstract: A data storage device includes a first memory device configured to provide first read data in response to a first read command, a controller including a hardware filter configured to generate first hint information based on a result of comparison of the first read data with filtering condition data and a processor configured to determine whether the first read data is to be filtered based on the first hint information, selectively filter the first read data based on the filtering condition data based on the determination result, and generate first filtered data, and a second memory device configured to store the first filtered data. The controller communicates the first filtered data to a host.

Abstract translation: 数据存储装置包括：第一存储装置，被配置为响应于第一读取命令提供第一读取数据;控制器，包括被配置为基于第一读取数据与滤波条件数据的比较结果产生第一提示信息的硬件滤波器 以及处理器，被配置为基于所述第一提示信息来确定是否要对所述第一读取数据进行过滤，基于所述确定结果，基于所述过滤条件数据选择性地过滤所述第一读取数据，并且生成第一过滤数据，以及第二存储器 被配置为存储第一经过滤数据的设备。 控制器将第一个过滤数据传送给主机。