公开(公告)号：US20170057161A1

公开(公告)日：2017-03-02

申请号：US15229981

申请日：2016-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Keon KUK ,  Eun-bong HAN ,  Young-dae KO ,  Hyeon-hyang KIM ,  O-hyun BEAK ,  Jun-hee LEE ,  Yeon-kyoung JUNG

IPC: B29C67/00 ,  B33Y70/00 ,  B33Y50/02 ,  B33Y30/00 ,  B33Y10/00

CPC classification number: B29C67/0059 ,  B29C64/112 ,  B29C64/386 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Abstract translation: 提供了一种物体形成装置及其控制方法。 物体形成装置包括：喷射器，被配置为基于物体数据喷射物体形成材料;通过堆叠注射物体形成材料形成物体的基部;被配置为检测堆叠在物体上的物体的高度的传感器 基部和控制器，被配置为基于从传感器输出的信号来控制喷射器。

公开(公告)号：US20160204073A1

公开(公告)日：2016-07-14

申请号：US14991800

申请日：2016-01-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： O-hyun BEAK ,  Keon KUK ,  Yong-chul KO ,  Woon-bae KIM

IPC: H01L23/552 ,  H05K1/18 ,  H01L21/56 ,  H01L21/02 ,  H01L23/48 ,  B05C5/00 ,  H01L23/29 ,  H01L21/3205 ,  H04W4/00 ,  H01L21/67 ,  B05C5/02 ,  H01L25/065 ,  H01L23/00

CPC classification number: H01L23/552 ,  B05C5/001 ,  B05C5/027 ,  H01L21/02255 ,  H01L21/32051 ,  H01L21/56 ,  H01L21/67115 ,  H01L23/291 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3135 ,  H01L23/481 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/04042 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/92125 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/14511 ,  H01L2924/15311 ,  H01L2924/15331 ,  H04W4/50 ,  H05K1/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract translation: 半导体封装包括安装在基板上的半导体芯片，覆盖半导体芯片的至少一部分并且包括触变材料或热熔材料的绝缘层，以及覆盖半导体芯片的至少一部分的屏蔽层和 绝缘层。 制造半导体封装的方法包括通过使用三维打印机形成具有高纵横比的绝缘层和屏蔽层。

公开(公告)号：US20170295679A1

公开(公告)日：2017-10-12

申请号：US15438008

申请日：2017-02-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyong-il KIM ,  Keon KUK ,  Il-ju MUN ,  O-hyun BEAK

IPC: H05K9/00 ,  B29C45/14 ,  H05K1/18

CPC classification number: H05K9/0088 ,  B29C45/14639 ,  B29K2101/12 ,  B29L2031/3425 ,  H01L2224/16227 ,  H01L2224/97 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/188 ,  H05K3/284 ,  H05K5/065 ,  H05K9/0022 ,  H01L2224/81

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

公开(公告)号：US20160262292A1

公开(公告)日：2016-09-08

申请号：US15061233

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keon KUK ,  Young-dae KO ,  O-hyun BEAK ,  Eun-bong HAN ,  Hyeon-hyang KIM ,  Yeon-kyoung JUNG ,  Il-ju MUN

IPC: H05K9/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/10 ,  B05B15/00 ,  H01L23/498 ,  H01L23/31 ,  H01L23/29 ,  H01L21/56 ,  H01L21/3205 ,  H05K1/18 ,  H01L23/552

CPC classification number: B05B15/20 ,  H01L23/24 ,  H01L23/49838 ,  H01L23/552 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0218 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2203/0126 ,  H05K2203/1316 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Abstract translation: 提供电路元件封装，其制造方法及其制造装置。 电路元件封装包括布置在印刷电路板上的电路元件，覆盖电路元件的绝缘层，覆盖绝缘层侧表面的第一屏蔽层和覆盖绝缘层上表面的第二屏蔽层，以及 电连接到第一屏蔽层。