公开(公告)号：US10082732B2

公开(公告)日：2018-09-25

申请号：US14280900

申请日：2014-05-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyungmo Yang ,  Kiwoong Kim ,  Kwangsu Seo ,  Sungjae Lee ,  Yongwoo Jeon ,  Wonhee Choi ,  Byounguk Yoon

IPC: G03F7/00 ,  G03F7/20 ,  B29C37/00 ,  B29C43/02 ,  B29C43/18 ,  B29C35/08 ,  B29C45/16 ,  H05K5/03 ,  H04M1/02

CPC classification number: G03F7/0002 ,  B29C35/0805 ,  B29C37/0053 ,  B29C43/021 ,  B29C43/18 ,  B29C45/1679 ,  B29C2035/0827 ,  B29C2037/0035 ,  B29C2037/0042 ,  G03F7/20 ,  H04M1/0283 ,  H05K5/03 ,  Y10T428/13 ,  Y10T428/1352

Abstract: A surface treatment method of an electronic device is provided. The surface treatment method includes processing a first pattern on a surface of a top mold and a second pattern on a surface of a bottom mold, coating a Ultra-Violet (UV) molding liquid on each of a front surface of a raw sheet material and the bottom mold facing a rear surface of the raw sheet material raw, positioning the raw sheet material between the top mold and the bottom mold, pressing the top mold and the bottom mold to each other, curing the UV molding liquid, and separating the raw sheet material from the top mold and the bottom mold and forming a print layer on the front surface and the rear surface of the raw sheet material.