公开(公告)号：US20250089371A1

公开(公告)日：2025-03-13

申请号：US18626413

申请日：2024-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： KYOUNGSUK YANG ,  SEONGHO SHIN ,  MI-NA CHOI ,  JU-YOUN CHOI

IPC: H01L27/12 ,  G09G3/00

Abstract: A driving circuit mounting film according to an embodiment includes a base film having a first surface and a second surface facing each other, a driving circuit part positioned on the first surface of the base film, a plurality of signal lines positioned on the first surface of the base film, and a test signal pad part positioned on the second surface of the base film, wherein the test signal pad part includes a plurality of openings, and at least part of the plurality of openings overlaps with at least part of the plurality of first signal lines.

公开(公告)号：US20250038156A1

公开(公告)日：2025-01-30

申请号：US18442252

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-JA KIM ,  SUNWON KANG ,  MI-NA CHOI

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/373 ,  H01L23/498

Abstract: A semiconductor package includes a first substrate. A second substrate is spaced apart from the first substrate. A semiconductor chip is between the first substrate and the second substrate. The semiconductor chip is electrically connected to the second substrate. A molding layer surrounds the semiconductor chip. A plate directly contacts a bottom surface of the semiconductor chip. A heat transfer structure connects the plate and the first substrate to each other.

公开(公告)号：US20240355770A1

公开(公告)日：2024-10-24

申请号：US18638939

申请日：2024-04-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YOUNG-DEUK KIM ,  MI-NA CHOI ,  HEEJUNG HWANG

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC classification number: H01L24/16 ,  H01L23/3107 ,  H01L23/481 ,  H01L24/05 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204

Abstract: A semiconductor package includes a first semiconductor chip. A second semiconductor chip is disposed on the first semiconductor chip. A bump structure is disposed between the first semiconductor chip and the second semiconductor chip. The bump structure electrically connects the first semiconductor chip and the second semiconductor chip to each other. The bump structure includes a first bump pad and a second bump pad disposed on a same plane as each other, and a solder bump disposed between the first bump pad and the second bump pad. The solder bump abuts on a side of the first bump pad and a side of the second bump pad.