公开(公告)号：US20170162500A1

公开(公告)日：2017-06-08

申请号：US15259024

申请日：2016-09-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chanho LEE ,  HYUNSOO CHUNG ,  Myeong Soon PARK

IPC: H01L23/522 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/5223 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0401 ,  H01L2224/05567 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/13082 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1403 ,  H01L2224/14104 ,  H01L2224/14166 ,  H01L2224/16238 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device comprising: a substrate; a decoupling capacitor disposed on the substrate; a first connection pad vertically overlapping with the decoupling capacitor; a passivation layer exposing a portion of the first connection pad; and a first solder bump disposed on the first connection pad and covering a portion of a top surface of the passivation layer.