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公开(公告)号:US20170162500A1
公开(公告)日:2017-06-08
申请号:US15259024
申请日:2016-09-07
Applicant: Samsung Electronics Co., Ltd.
Inventor: Chanho LEE , HYUNSOO CHUNG , Myeong Soon PARK
IPC: H01L23/522 , H01L23/00 , H01L23/498
CPC classification number: H01L23/5223 , H01L23/49816 , H01L24/13 , H01L24/14 , H01L2224/0401 , H01L2224/05567 , H01L2224/13021 , H01L2224/13022 , H01L2224/13082 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/1312 , H01L2224/13139 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14104 , H01L2224/14166 , H01L2224/16238 , H01L2924/014 , H01L2924/00014
Abstract: A semiconductor device comprising: a substrate; a decoupling capacitor disposed on the substrate; a first connection pad vertically overlapping with the decoupling capacitor; a passivation layer exposing a portion of the first connection pad; and a first solder bump disposed on the first connection pad and covering a portion of a top surface of the passivation layer.