公开(公告)号：US20130193545A1

公开(公告)日：2013-08-01

申请号：US13749178

申请日：2013-01-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-Gyu Jeong ,  Young-Shin Kwon ,  Pyoung-Wan Kim ,  Seung-Kon Mok ,  Hyun-Su Jun

IPC: H01L31/0236 ,  H01L29/30

CPC classification number: H01L31/0236 ,  H01L27/14618 ,  H01L27/14683 ,  H01L29/30 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A semiconductor apparatus and a method of fabricating the same are provided. The semiconductor apparatus includes a body part having a first surface and a second surface facing each other, a first trench formed into the first surface of the body part, a second trench formed into the second surface of the body part, an opening connecting the first trench and the second trench to each other, a first adhesion enhancer, such as a rough surface, formed on a bottom surface of the first trench, and a second adhesion enhancer, such as a rough surface, formed on the second surface of the body part.

Abstract translation: 提供半导体装置及其制造方法。 该半导体装置包括具有第一表面和彼此面对的第二表面的主体部分，形成在主体部分的第一表面中的第一沟槽，形成在主体部分的第二表面中的第二沟槽，连接第一 沟槽和第二沟槽，形成在第一沟槽的底表面上的第一粘附增强剂，例如粗糙表面，以及形成在主体的第二表面上的第二粘附增强剂，例如粗糙表面 部分。

公开(公告)号：US10483150B2

公开(公告)日：2019-11-19

申请号：US15349327

申请日：2016-11-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gun-Ah Lee ,  Ji-Hwan Hwang ,  Cha-Jea Jo ,  Dong-Han Kim ,  Seung-Kon Mok

IPC: H01L21/683 ,  H01L21/67 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L25/00

Abstract: An apparatus for stacking semiconductor chips includes a push member configured to apply pressure to a semiconductor chip disposed on a substrate. The push member includes a push plate configured to contact the semiconductor chip, and a push rod connected to the push plate. The push plate includes a central portion having an area smaller than an area of an upper side of the semiconductor chip, and a plurality of protrusions disposed at respective ends of the central portion.

公开(公告)号：US09190401B2

公开(公告)日：2015-11-17

申请号：US14286454

申请日：2014-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choong-Bin Yim ,  Seung-Kon Mok ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L25/50 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

Abstract translation: 半导体封装包括第一半导体封装，包括第一印刷电路板和安装在第一印刷电路板上的第一半导体器件，以及堆叠在第一半导体封装上的第二半导体封装，并且包括第二印刷电路板和第二半导体 装置安装在第二印刷电路板上。 半导体封装包括至少一个第一通孔，其通过第一半导体器件将第二半导体封装电连接到第一印刷电路板。