公开(公告)号：US20240243110A1

公开(公告)日：2024-07-18

申请号：US18235643

申请日：2023-08-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYEONJEONG HWANG ,  SUNGEUN JO

IPC: H01L25/10 ,  H01L23/00 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H10B80/00

CPC classification number: H01L25/105 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H10B80/00 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/32137 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2225/1005 ,  H01L2924/1438 ,  H01L2924/16235

Abstract: Disclosed is a semiconductor package comprising an interposer substrate, a chip stack on the interposer substrate and including first semiconductor chips that are vertically stacked, a second semiconductor chip on the interposer substrate and horizontally spaced apart from the chip stack, a molding layer on the interposer substrate and surrounding the chip stack and the second semiconductor chip, a redistribution layer on the molding layer, and a plurality of conductive posts that vertically penetrate the molding layer and connect the interposer substrate to the redistribution layer.

公开(公告)号：US20230124783A1

公开(公告)日：2023-04-20

申请号：US17961371

申请日：2022-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAECHOON KIM ,  TAEHWAN KIM ,  SEUNGGEOL RYU ,  EUNGCHANG LEE ,  KIWOOK JUNG ,  SUNGEUN JO

IPC: H01L23/473 ,  H01L21/48 ,  H01L23/31 ,  H01L23/29 ,  H01L25/065

Abstract: A semiconductor package includes; a package substrate, an interposer disposed on the package substrate, semiconductor chips mounted on the interposer, a molding member on the interposer and surrounding the semiconductor chips, a first sealing member on the molding member, and a heat dissipation member on the package substrate and covering the interposer, the semiconductor chips, and the first sealing member, wherein the heat dissipation member includes a lower structure contacting an upper surface of the package substrate, and an upper structure on the lower structure, extending over the first sealing member, and including a microchannel and a micropillar on the microchannel.

公开(公告)号：US20230060513A1

公开(公告)日：2023-03-02

申请号：US17689707

申请日：2022-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KIWOOK JUNG ,  JAECHOON KIM ,  SEUNGGEOL RYU ,  SUNGEUN JO

IPC: H01L23/34 ,  H01L23/538 ,  H01L23/31

Abstract: A semiconductor package is provided. The semiconductor package includes first and second semiconductor chips mounted on an interposer structure, an insulating filler covering sides of the first and second semiconductor chips, a first thermal interface material (TIM) layer arranged on the insulating filler, and second TIM layers arranged on the first and second semiconductor chips. The thermal conductivity of each of the second TIM layers is higher than that of the first TIM layer and the first TIM layer is between the second TIM layers.