SEMICONDUCTOR PACKAGE
    2.
    发明申请

    公开(公告)号:US20220328389A1

    公开(公告)日:2022-10-13

    申请号:US17535093

    申请日:2021-11-24

    Abstract: A semiconductor package comprises a first redistribution substrate including first interconnection layers sequentially stacked on each other, a semiconductor chip mounted on the first redistribution substrate, a mold layer disposed on the first redistribution substrate and surrounding the semiconductor chip, a second redistribution substrate disposed on the mold layer and including second interconnection layers sequentially stacked on each other, a connection terminal disposed beside the semiconductor chip to connect the first and second redistribution substrates to each other, and outer terminals disposed on a bottom surface of the first redistribution substrate. Each of the first and second interconnection layers may include an insulating layer and a wire pattern in the insulating layer. The first redistribution substrate may have substantially the same thickness as the second redistribution substrate, and the first interconnection layers may be thinner than the second interconnection layers.

    SEMICONDUCTOR PACKAGE
    3.
    发明申请

    公开(公告)号:US20220037294A1

    公开(公告)日:2022-02-03

    申请号:US17184978

    申请日:2021-02-25

    Abstract: A semiconductor package includes a first redistribution substrate, a first semiconductor chip mounted on the first redistribution substrate, a first molding layer on the first redistribution substrate and covering a top surface and lateral surfaces of the first semiconductor chip, a second redistribution substrate on the first molding layer, and an adhesive film between the second redistribution substrate and the first molding layer. The adhesive film is spaced apart from the first semiconductor chip and covers a top surface of the first molding layer. A lateral surface of the adhesive film is coplanar with a lateral surface of the second redistribution substrate.

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

    公开(公告)号:US20220415771A1

    公开(公告)日:2022-12-29

    申请号:US17670635

    申请日:2022-02-14

    Abstract: A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

    SEMICONDUCTOR PACKAGE
    6.
    发明申请

    公开(公告)号:US20250132218A1

    公开(公告)日:2025-04-24

    申请号:US18623488

    申请日:2024-04-01

    Abstract: A semiconductor package includes: a first substrate; a first semiconductor chip; a second semiconductor chip being spaced apart, in a first direction, from the first substrate, the first direction being parallel to a top surface of the first substrate; at least one thermal radiation structure on the first substrate and between the first semiconductor chip and the second semiconductor chip; and a third semiconductor chip on the first semiconductor chip, the second semiconductor chip, and the at least one thermal radiation structure, wherein the at least one thermal radiation structure includes: a thermal radiation post; and a thermal conductive pattern on the thermal radiation post, wherein a bottom surface of the third semiconductor chip is in contact with the thermal conductive pattern, and wherein the top surface of the first substrate is in contact with the thermal radiation post.

Patent Agency Ranking