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公开(公告)号：US11538701B2
公开(公告)日：2022-12-27
申请号：US16791564
申请日：2020-02-14
发明人： Taehyoung Lee , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC分类号： H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
摘要： A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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公开(公告)号：US12057621B2
公开(公告)日：2024-08-06
申请号：US17475507
申请日：2021-09-15
发明人： Pilwon Seo , Bomi Lee , Sangil Im , Ilseub Kim , Heedong Kim , Yeonkwan Seo
CPC分类号： H01Q1/243 , H01Q1/48 , H04B1/0057
摘要： An electronic device and method are disclosed. The electronic device includes a first antenna configured to communicate using a first frequency band group, a ground switch coupled to the first antenna, a second antenna configured to communicate using a second frequency band group, wherein the second antenna overlaps the first antenna, a band selection switch configured to select one of multiple radio frequency (RF) paths for the second frequency band group, and a processor. The processor implements the method, including determining a communication frequency band, when the communication frequency band is unsupported by the second antenna, identifying an RF path corresponding to the communication frequency band from among the multiple RF paths, and controlling the band selection switch to select the identified RF path for operative connection to the second antenna.
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公开(公告)号：US20210013074A1
公开(公告)日：2021-01-14
申请号：US16791564
申请日：2020-02-14
发明人： TAEHYOUNG LEE , Byeongsang Kim , Sung Chai Kim , Wooram Kim , Kyungwon Yun , Keonho Lee , Sangil Im , Namyoung Cho
IPC分类号： H01L21/67 , G05B19/406 , G06T7/00 , G01N21/88 , G01N21/954
摘要： A method of inspecting a semiconductor processing chamber includes providing a vision sensor into the semiconductor processing chamber, aligning the vision sensor on a target in the semiconductor processing chamber, obtaining an object image of the target using an image scanning module of the vision sensor, generating a three dimensional model of the target based on the object image, and obtaining a physical quantity of the target from the three dimensional model. The obtaining of the object image of the target includes projecting a pattern onto the target using an illuminator of the image scanning module, and scanning an image of the target in which the pattern is projected, using a camera of the image scanning module.
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